Collapsible Patch and Method of Application

• US 20080195035A1
• Filed: 06/23/2006
• Published: 08/14/2008
• Est. Priority Date: 06/24/2005
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Frederickson, Franklyn L., Johnson, Michael D., Wirtanen, David J.
• Application Number:
  US11/917,300
• Publication Number:
  US 20080195035A1
• Time in Patent Office: Days
• US Class Current: 604/22
• CPC Class Codes: A61K 9/0021 Intradermal administration, e.g. through microneedle arrays, needleless injectors mechanical aspects A61M
• CPC Class Codes: A61M 2037/0023 Drug applicators using microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles

Abstract

A microneedle patch (30) includes a base (32), at least one collapsible side wall (34) extending from the base, and a lip (36) disposed along the at least one collapsible sidewall and opposite the base. An adhesive (38) is disposed along the base, and a microneedle array (40) is affixed to the base.

Claims

1. A microneedle patch comprising:

a base, at least one collapsible side wall extending from the base, and a lip disposed along the at least one collapsible sidewall and opposite the base;

an adhesive disposed along the base; and

a microneedle array affixed to the base.

2. The microneedle patch of claim 1, wherein the adhesive disposed on the base surrounds the microneedle array.

3. A microneedle patch assembly comprising:

a collapsible patch element having a base and at least one side wall extending from the base, wherein the base has an upper face and an opposite bottom face, and wherein the at least one side wall generally extends from the bottom face of the base;

a microneedle array affixed to the bottom face of the base of the collapsible patch element; and

a first carrier disposed adjacent to the collapsible patch element and relative to the bottom face of the base, wherein the first carrier covers the microneedle array, and wherein the first carrier is separable from the collapsible patch element.

4. The assembly of claim 3, and further comprising:

a second carrier disposed adjacent to the collapsible patch element and relative to the upper face of the base.

5. The assembly of claim 4, wherein the second carrier is separable from the collapsible patch element.

6. The assembly of claim 4, wherein the second carrier has an opening defined therein for permitting a portion of an application device to contact the collapsible patch element for microneedle array deployment while the second carrier remains positioned adjacent to the collapsible patch element.

7. The assembly of claim 4, wherein the second carrier is formed of a material that is generally more rigid than the at least one side wall of the collapsible patch element.

8. The assembly of claim 4, wherein the first and second carriers are sealed together to form a closed package that contains the collapsible patch element.

9. The assembly of claim 3, wherein the first carrier has a lower portion and a raised portion with a recess, wherein the raised portion is generally configured to mate with the collapsible patch element, and wherein the recess is configured such that the first carrier does not touch the microneedle array.

10. The assembly of claim 9, wherein the raised portion of the first carrier is releasably affixed to the base of the collapsible patch element.

11. The assembly of claim 3, and further comprising:

an adhesive disposed along the base of the collapsible patch element.

12. The assembly of claim 3, wherein collapse of the collapsible patch element causes deformation of the at least one side wall.

13. The assembly of claim 3, and further comprising:

at least one air outlet defined in the collapsible patch element.

14. The assembly of claim 13, wherein the at least one air outlet is an opening in the at least one side wall of the collapsible patch element.

15. The assembly of claim 3, wherein the collapsible patch element further comprises:

a lip disposed along the at least one sidewall and opposite the base.

16. The assembly of claim 15, wherein the at least one air outlet is a generally U-shaped channel disposed along the surface of the lip opposed to the base.

17. The assembly of claim 15, wherein the at least one air outlet is defined adjacent one or more ribs, each rib being disposed along the surface of the lip opposed to the base.

18. The assembly of claim 17, wherein the rib is elongate in shape and extends radially with respect to an axis defined at a center of the base.

19. The assembly of claim 15, and further comprising:

an adhesive disposed along the lip.

20. The assembly of claim 3, wherein the first carrier is formed of a material that is generally more rigid than the at least one side wall of the collapsible patch element.

21. A microneedle patch assembly comprising:

a web of material having an upper face and a lower face;

an adhesive disposed along the lower face of the web of material; and

a microneedle array affixed to the lower face of the web of material,

wherein the patch has a first state wherein the web of material defines a first volume relative to its lower face and the microneedle array is spaced from a target site, and wherein the patch has a second state wherein the web of material defines a second volume that is less than the first volume and the microneedle array contacts the target site.

22. (canceled)

23. (canceled)

24. (canceled)

25. (canceled)

26. (canceled)