Image sensor and method of manufacturing the same
First Claim
Patent Images
1. An image sensor, comprising:
- an inorganic layer on a substrate including unit pixels;
lens seed patterns selectively disposed on the inorganic layer, the lens seed patterns comprising an organic material; and
microlenses on the lens seed patterns.
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Abstract
Provided is an image sensor and method of manufacturing the same. The image sensor can include a semiconductor substrate, a metal interconnection layer, an inorganic layer, lens seed patterns, and microlenses. The semiconductor substrate can include unit pixels. The metal interconnection layer can be disposed on the semiconductor substrate to provide signal and poser connections to the unit pixels. The inorganic layer can be disposed on the metal interconnection layer. The lens seed patterns are selectively disposed on the inorganic layer and are formed of an organic material. The microlenses are formed on the lens seed patterns.
163 Citations
17 Claims
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1. An image sensor, comprising:
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an inorganic layer on a substrate including unit pixels; lens seed patterns selectively disposed on the inorganic layer, the lens seed patterns comprising an organic material; and microlenses on the lens seed patterns. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing an image sensor, comprising:
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forming an inorganic layer on a semiconductor substrate including unit pixels; selectively forming lens seed patterns comprising an organic material on the inorganic layer; and forming microlenses on the lens seed patterns. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification