Battery-assisted backscatter RFID transponder

• US 20080272890A1
• Filed: 10/31/2007
• Published: 11/06/2008
• Est. Priority Date: 06/30/2005
• Status: Abandoned Application

• Current Assignee: Doron Lavee, Gaby Guri, Zvi Nitzan
• Original Assignee: Doron Lavee, Gaby Guri, Zvi Nitzan
• Inventors: Nitzan, Zvi, Guri, Gaby, Lavee, Doron
• Application Number:
  US11/930,870
• Publication Number:
  US 20080272890A1
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence

Abstract

A radio frequency transponder includes at least one battery, which is coupled to provide electrical power for operating the transponder and at least one antenna, which is configured to receive and backscatter RF interrogation radiation from an interrogation device. An integrated circuit is arranged to store a code including information and, powered only with energy provided by the battery, to vary a radiation characteristic of the antenna responsively to the code so as to modulate the information onto the backscattered radiation.

Claims

1. A Radio Frequency (RF) transponder comprising:

an integrated circuit;

an electrochemical power source electrically coupled to said integrated circuit;

an antenna structure including a backscatter modulation element coupled to said integrate circuit; and

wherein said transponder has a thickness of less than 1 mm.

2. The transponder according to claim 1, further comprising a substrate having the electrochemical power source, the antenna and the integrated circuit disposed thereon.

3. The transponder according to claim 1, wherein the electrochemical power source further comprises at least a printed anode layer, a printed electrolyte layer, a printed cathode layer disposed in at least one of a co-planar and a co-facial configuration, and wherein the electrolyte layer is disposed between the anode layer and the cathode layer.

4. The transponder according to claim 2, wherein the substrate is flexible.

5. The transponder according to claim 1, wherein the antenna is selected from the group consisting of at least one of a monopole, a bent monopole, a dipole, a bent dipole, a patch, an array antenna and a combination thereof.

6. The transponder according to claim 5, wherein said transponder has a bending radius of no greater than 25 mm.

7. A Radio Frequency (RF) transponder comprising:

an integrated circuit;

an electrochemical power source electrically coupled to said integrated circuit;

an antenna structure including a backscatter modulation element coupled to said integrate circuit; and

wherein said transponder is substantially flexible.

8. The transponder according to claim 7, wherein said transponder has a bending radius of no greater than 25 mm.

9. The transponder according to claim 7, further comprising a substrate having the electrochemical power source, the antenna and the integrated circuit disposed thereon.

10. The transponder according to claim 7, wherein the electrochemical power source further comprises:

at least a printed anode layer;

a printed electrolyte layer;

a printed cathode layer disposed in at least one of a co-planar and a co-facial configuration; and

wherein the electrolyte layer is disposed between the anode layer and the cathode layer.

11. The transponder according to claim 7, wherein the antenna is selected from the group consisting of at least one of a monopole, a bent monopole, a dipole, a bent dipole, a patch, an array antenna and a combination thereof.

12. The transponder according to claim 7, wherein said transponder has a thickness of less than 1 mm

13. The transponder according to claim 7, wherein said transponder has a thickness of less than 5 mm

14. A Radio Frequency (RF) transponder comprising:

an integrated circuit;

an electrochemical power source electrically coupled to said integrated circuit;

an antenna structure including a backscatter modulation element coupled to said integrate circuit; and

wherein said transponder has a thickness of less than 5 mm.

15. The transponder according to claim 14, further comprising a substrate having the electrochemical power source, the antenna and the integrated circuit disposed thereon.

16. The transponder according to claim 15, wherein the electrochemical power source further comprises at least a printed anode layer, a printed electrolyte layer, a printed cathode layer disposed in at least one of a co-planar and a co-facial configuration, and wherein the electrolyte layer is disposed between the anode layer and the cathode layer.

17. The transponder according to claim 14, wherein the substrate is flexible.

18. The transponder according to claim 14, wherein the antenna is selected from the group consisting of at least one of a monopole, a bent monopole, a dipole, a bent dipole, a patch, an array antenna and a combination thereof.

19. The transponder according to claim 14, wherein said transponder has a bending radius of no greater than 25 mm.