Solid-State Lighting Device Package

• US 20080296589A1
• Filed: 03/24/2006
• Published: 12/04/2008
• Est. Priority Date: 03/24/2005
• Status: Abandoned Application

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Schick, Philippe, Speier, Ingo
• Application Number:
  US10/582,565
• Publication Number:
  US 20080296589A1
• Time in Patent Office: Days
• US Class Current: 257/82
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/648 the elements comprising fluids, e.g. heat-pipes

Abstract

The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light-emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements.

Claims

1. A lighting device package comprising:

a) a substrate including a thermally conductive region;

b) one or more light-emitting elements mounted on the substrate to provide thermal connectivity between the one or more light-emitting elements and the thermally conductive region, the one or more light-emitting elements for generating light; and

c) an optical system coupled to the substrate and configured to substantially enclose the one or more light-emitting elements on the substrate, the optical system adapted to extract the light from the one or more light-emitting elements;

wherein the lighting device package is adapted for connection to a means for controlling activation of the one or more light-emitting elements.

2. The lighting device package according to claim 1, wherein the thermally conductive region is adapted for intimate thermal connection to a thermally conductive element.

3. The lighting device package according to claim 2, wherein the thermally conductive element is a heat sink, heat pipe, thermosyphon, heat exchanger, micro-cooler heat exchanger, thermoelectric, thermotunnel, heat spreader or heat sink.

4. The lighting device package according to claim 2, wherein the intimate thermal connection is by one or more of a thermal grease, thermal transfer film, thermal conductive epoxy and a thermally conductive solder.

5. The lighting device package according to claim 1, wherein the substrate is configured as a thermally conductive substrate.

6. The lighting device package according to claim 1, wherein the substrate includes a carrier portion proximate to the thermally conductive region, the carrier portion configured to expose the thermally conductive region for thermal access thereto.

7. The lighting device package according to claim 6, wherein the carrier portion is etched to create a micro-cooler heat exchanger.

8. The lighting device package according to claim 1, wherein the substrate has a central region, said central region is formed as a depression, said central region having side walls wherein the side walls are optically active.

9. The lighting device package according to claim 1, wherein the substrate comprises circuit traces providing electrical connections to the one or more light-emitting elements.

10. The lighting device package according to claim 1, further comprising one or more sensors mounted onto the substrate.

11. The lighting device package according to claim 10, wherein the one or more sensors is an optical sensor.

12. The lighting device package according to claim 10, wherein the one or more sensors is a temperature sensor.

13. The lighting device package according to claim 10, wherein the one or more sensors are substantially enclosed by the optical system.

14. The lighting device package according to claim 1, wherein the optical system is formed from one or more of reflective optical element, refractive optical element, diffractive optical element and encapsulation material.

15. The lighting device package according to claim 14, wherein the optical system is a refractive optical element formed as a dome lens or a micro-lens array.

16. The lighting device package according to claim 15, wherein the dome lens is spherical or aspherical.

17. The lighting device package according to claim 16, wherein each of the one or more light-emitting elements has a light emitting surface and the dome lens has a curvature having a centre, and wherein the light emitting surface is positioned at the centre of curvature.

18. The lighting device package according to claim 15, wherein encapsulation material fills a space between the one or more light-emitting elements and the dome lens.

19. The lighting device package according to claim 1, wherein the optical system is an encapsulation material is patterned or textured.

20. The lighting device package according to claim 18, wherein the encapsulation material is stamped, sanded, embossed or micro-structured.

21. The lighting device package according to claim 1, further comprising secondary optical elements configured to mate with the optical system.

22. The lighting device package according to claim 21, wherein the secondary optical elements are one or more of diffractive optics, refractive optics or reflective optics.