Programmable semiconductor interposer for electronic package and method of forming

  • US 20080296697A1
  • Filed: 05/29/2007
  • Published: 12/04/2008
  • Est. Priority Date: 05/29/2007
  • Status: Active Grant
First Claim
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1. A semiconductor interposer comprising:

  • a substrate;

    an array of semiconductor devices having various electrical parameters formed in said substrate;

    one or more first conductive contact pads formed on a first surface of said substrate;

    one or more second conductive contact pads formed on a second surface of said substrate;

    one or more conductive paths passing through said substrate and connecting at least one of the first contact pads to at least one of the second contact pads;

    a device selection unit formed in said substrate;

    wherein said device selection unit selectively connects at least one of said devices to said first contact pads and forms a virtual element having a desired electrical parameter.

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