Adhesive Formulation, Method for Production and Use Thereof
First Claim
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1. Adhesive formulation in the form of an aqueous dispersion with a solid content of 1 to 50% containing:
- a) 0.001 to 5 mol of an epoxide with a molecular weight of 50-290 in dissolved form, relative to 1000 g of the total formulationb) 0.1 to 20% of a totally or partially blocked isocyanate, as solid andc) 0.1 to 40% of a resorcinol-formaldehyde-latex (RFL) as solid.
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Abstract
The invention relates to an adhesive formulation for the treatment of reinforcing layers which are provided for the production of reinforced polymer products, the adhesive formulation containing dissolved epoxide.
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20 Claims
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1. Adhesive formulation in the form of an aqueous dispersion with a solid content of 1 to 50% containing:
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a) 0.001 to 5 mol of an epoxide with a molecular weight of 50-290 in dissolved form, relative to 1000 g of the total formulation b) 0.1 to 20% of a totally or partially blocked isocyanate, as solid and c) 0.1 to 40% of a resorcinol-formaldehyde-latex (RFL) as solid. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification