Novel Packaging Solution for Highly Filled Phase-Change Thermal Interface Material

• US 20080302064A1
• Filed: 07/08/2005
• Published: 12/11/2008
• Est. Priority Date: 07/13/2004
• Status: Abandoned Application

• Current Assignee: Robert A. Rauch
• Original Assignee: Robert A. Rauch
• Inventors: Rauch, Robert A.
• Application Number:
  US11/571,748
• Publication Number:
  US 20080302064A1
• Time in Patent Office: Days
• US Class Current: 53/329
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A packaging system, packaging method and method of depositing a thin layer of material at a desired location upon a substrate, and in particular a layer of thermally-conductive phase change material at the interface between a heat-dissipating component and heat sink coupled therewith. The packaging comprises a thin layer of material sandwiched between a first base liner and a second top liner. A segment of tape is adhesively bound to the top liner and preferably includes a graspable portion, such as a tab, to enable the same to pull the top liner away from the material to thus leave the layer of material deposited upon the substrate.

Claims

1. A packaging system for a layer of material comprising:

a) a base liner, said layer of material being formed upon said base liner;

b) a top liner disposed substantially over said layer of material deposited upon said base liner; and

c) a tape segment adhesively bound to at least a portion of said top liner.

2. The system of claim 1 wherein said layer of material comprises a thermally-conductive composition.

3. The system of claim 2 wherein said thermally-conductive composition possesses phase-change properties.

4. The system of claim 1 wherein said segment of tape has a tab formed thereon.

5. The system of claim 1 wherein said base liner and said top liner comprise paper release liners.

6. The system of claim 1 wherein said layer of material and said top liner define a length and a width and said tape extends across a respective one of said length and width defined by said layer of material and top liner.

7. The system of claim 6 wherein said layer of tape further extends to and is adhesively bound to said base liner.

8. The system of claim 7 wherein said tape is adhesively bound to said base liner at a point beyond the peripheral edge defined by said layer of material and said top liner.

9. The system of claim 1 wherein said layer of material comprises a thermally-conductive composition having a thickness of approximately 8 mil.

10. A method for packaging a layer of material comprising the steps:

a) providing a base liner;

b) depositing said layer of material upon said base liner provided in step a);

c) placing a top liner over said layer of material deposited upon said base liner; and

d) rolling said base liner and top liner with layer of material disposed therebetween such that said layer of material assumes a desired thickness; and

e) adhesively attaching a segment of tape to said top liner positioned over said layer of material in step c).

11. The method of claim 10 wherein in step b), said layer of material comprises a thermally-conductive composition;

and wherein in step d), said layer is formed to have a thickness of approximately 8 mil.

12. The method of claim 11 wherein in step b), said thermally-conductive material is a phase-change material.

13. The method of claim 10 wherein in step d), said tape segment is adhesively attached to both said top liner and said base liner.

14. The method of claim 10 wherein in step d), said layer is formed to have a specific surface area.

15. The method of claim 14 wherein said layer of material is formed to have a generally square shape.

16. The method of claim 15 wherein said generally square shape is approximately one inch by one inch.

17. The method of claim 10 wherein following step e) said method further comprises the step:

a) forming a tab upon said segment of tape.

18. The method of claim 17 wherein said tab is formed by folding a portion of said tape segment upon itself.

24. The method of claim 10 wherein said method further comprises the step:

a) forming said packaged layer of material in step d) as a roll.

19. A method of applying a pre-packaged layer of material upon a desired portion of a substrate comprising the steps:

a) providing a pre-packaged layer of material, said pre-packaged layer of material comprising;

i) a base liner and a top liner, said layer of material being disposed between said base liner and top liner; and

ii) a tape segment adhesively bound to at least a portion of said top liner;

b) removing said base liner from said packaging such that a portion of said layer of material is exposed;

c) placing said exposed layer of material in step b) upon the desired portion of said substrate; and

d) pulling said tape with said top liner adhesively bound thereto away from said layer of material positioned upon said substrate in step c).

20. The method of claim 19 wherein in step a), said layer of material comprises a thermally-conductive material and wherein in step c), said substrate comprises a heat sink.

21. The method of claim 20 wherein said thermally-conductive material comprises a phase change material.

22. The method of claim 19 wherein in step a), said base liner and said top liner comprise paper release liners.

23. The method of claim 19 wherein step c) further comprises adhesively attaching a portion of said tape segment to said substrate.