INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH
First Claim
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1. An integrated circuit comprising:
- an integrated circuit die including;
a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling;
an antenna section, coupled to the millimeter wave transceiver, for facilitating the RF signaling, wherein the antenna section includes at least one bonding wire;
a substrate coupled to support the first integrated circuit die.
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Abstract
An integrated circuit includes an integrated circuit die having a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling. An antenna section facilitates the RF signaling, wherein the antenna section includes at least one bonding wire. A substrate is coupled to support the first integrated circuit die.
215 Citations
19 Claims
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1. An integrated circuit comprising:
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an integrated circuit die including; a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling; an antenna section, coupled to the millimeter wave transceiver, for facilitating the RF signaling, wherein the antenna section includes at least one bonding wire; a substrate coupled to support the first integrated circuit die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An integrated circuit comprising:
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an integrated circuit die including; a millimeter wave transceiver for communicating with a remote device via millimeter wave RF signaling, wherein the millimeter wave transceiver includes a millimeter wave receiver for receiving a first millimeter wave RF signal from the remote device and a millimeter wave transmitter for transmitting a second millimeter wave signal to the remote device; an antenna section for facilitating the RF signaling, wherein the antenna section includes at least one bonding wire; an impedance matching circuit, coupled to the millimeter wave transceiver and the at least one bonding wire, that provides impedance matching to the millimeter wave transceiver and the antenna section. a substrate coupled to support the first integrated circuit die. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A method for use in an integrated circuit, the method comprising:
communicating with a remote device via millimeter wave RF signaling via an antenna that includes an antenna element formed by a bonding wire of the integrated circuit.
Specification