AUTOMATED SYSTEMS AND METHODS FOR ADAPTING SEMICONDUCTOR FABRICATION TOOLS TO PROCESS WAFERS OF DIFFERENT DIAMETERS

  • US 20090067954A1
  • Filed: 09/07/2007
  • Published: 03/12/2009
  • Est. Priority Date: 09/07/2007
  • Status: Active Grant
First Claim
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1. A method comprising:

  • providing a semiconductor fabrication tool;

    placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction;

    placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter; and

    moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.

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