AUTOMATED SYSTEMS AND METHODS FOR ADAPTING SEMICONDUCTOR FABRICATION TOOLS TO PROCESS WAFERS OF DIFFERENT DIAMETERS

• US 20090067954A1
• Filed: 09/07/2007
• Published: 03/12/2009
• Est. Priority Date: 09/07/2007
• Status: Active Grant

• Current Assignee: Suzhou Technology Institute For Nanotech Industry
• Original Assignee: Advanced Technology Development Facility Incorporated (SVTC Technologies, LLC)
• Inventors: Lanee, Khamsidi, Moore, Gerry
• Granted Patent: US 7,824,146 B2
• Time in Patent Office: Days
• US Class Current: 414/172
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins

Abstract

Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters are described. In one embodiment, a method comprises providing a semiconductor fabrication tool, placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction, placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter, and moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.

Claims

1. A method comprising:

providing a semiconductor fabrication tool;

placing an adapter ring on a plurality of ring holders via a robotic arm, the plurality of ring holders being operable to support the adapter ring at a vertical distance from a stage heater and the stage heater being movable in a vertical direction;

placing a first semiconductor wafer on the stage heater via the robotic arm, the first semiconductor wafer having a first diameter; and

moving the stage heater upward to receive the adapter ring from the plurality of ring holders and to cover a portion of the stage heater during processing of the first semiconductor wafer.

2. The method of claim 1, further comprising maintaining a vacuum chamber of the semiconductor fabrication tool closed, the vacuum chamber comprising the stage heater.

3. The method of claim 1, further comprising:

moving the stage heater downward to return the adapter ring to the plurality of ring holders;

removing the first semiconductor wafer from the stage heater via the robotic arm;

removing the adapter ring from the plurality of plurality ring holders via the robotic arm;

placing a second semiconductor wafer on the stage heater via the robotic arm, the second semiconductor wafer having a second diameter greater than the first diameter; and

moving the stage heater upward to process the second semiconductor wafer.

4. A semiconductor fabrication tool comprising:

an adapter ring operable to cover a portion of a stage heater during a processing of a first semiconductor wafer having a first diameter, the first diameter being smaller than a diameter of the stage heater and the stage heater being operable to move in a vertical direction; and

a plurality of ring holders operable to hold the adapter ring at a vertical distance from the stage heater while a robotic arm places the first semiconductor wafer on the stage heater.

5. The semiconductor processing tool of claim 4, where the plurality of ring holders are coupled to a showerhead.

6. The semiconductor processing tool of claim 4, where the plurality of ring holders are coupled to a support structure surrounding a showerhead.

7. The semiconductor processing tool of claim 4, where the plurality of ring holders is operable to hold the adapter ring at the vertical distance from the stage heater while the robotic arm removes the first semiconductor wafer from the surface of the stage heater.

8. The semiconductor processing tool of claim 4, where the robotic arm is operable to place the adapter ring on the plurality of ring holders while maintaining a vacuum chamber of the semiconductor fabrication tool closed, the vacuum chamber comprising the stage heater.

9. The semiconductor processing tool of claim 8, where the robotic arm is operable to align the adapter ring with the stage heater.

10. The semiconductor processing tool of claim 4, where the robotic arm is operable to remove the adapter ring from the plurality of ring holders while maintaining a vacuum chamber of the semiconductor fabrication tool closed, the vacuum chamber comprising the stage heater.

11. A method comprising:

providing a semiconductor fabrication tool comprising a stage heater having a plurality of wafer lifts, a baffle surrounding the stage heater and having a plurality of ring lifts, and an arm lift having a plurality of wafer lift pins and a plurality ring lift pins, the plurality of ring lift pins being aligned with the plurality of ring lifts and the plurality of wafer lift pins being aligned with the plurality of wafer lifts;

moving the arm lift upward to cause the plurality of ring lift pins to raise the plurality of ring lifts and to cause the plurality of wafer lift pins to raise the plurality of wafer lifts;

placing an adapter ring on the plurality of ring lifts via a robotic arm;

placing a first semiconductor wafer having a first diameter on the plurality of wafer lifts via the robotic arm; and

moving the arm lift downward to lower the plurality of wafer lifts and the plurality of ring lifts, thus resting the first semiconductor wafer and adapter ring on a surface of the stage heater, the adapter ring covering a portion of the stage heater.

12. The method of claim 11, further comprising maintaining a vacuum chamber of the semiconductor fabrication tool closed, the vacuum chamber comprising the stage heater.

13. The method of claim 11, further comprising:

moving the arm lift upward to cause the plurality of ring lift pins to raise the plurality of ring lifts and to cause the plurality of wafer lift pins to raise the plurality of wafer lifts;

removing the first semiconductor wafer from the plurality of wafer lifts via the robotic arm;

removing the adapter ring from the plurality of ring lifts via the robotic arm;

placing a second semiconductor wafer on the plurality of wafer lifts via the robotic arm, the second semiconductor wafer having a second diameter greater than the first diameter; and

moving the arm lift downward to place the second semiconductor wafer on the surface of the stage heater.

14. A semiconductor fabrication tool comprising:

a stage heater having a plurality of wafer lifts;

a baffle surrounding the stage heater and having a plurality of ring lifts; and

an arm lift having a plurality of wafer lift pins and a plurality ring lift pins, the plurality of ring lift pins being aligned with the plurality of ring lifts and the plurality of wafer lift pins being aligned with the plurality of wafer lifts.

15. The semiconductor processing tool of claim 14, where the arm lift is operable to move upward to cause the plurality of ring lift pins to raise the plurality of ring lifts and to cause the plurality of wafer lift pins to raise the plurality of wafer lifts.

16. The semiconductor processing tool of claim 14, further comprising a robotic arm operable to place an adapter ring on the plurality of ring lifts and a first semiconductor wafer on the plurality of wafer lifts, the first semiconductor wafer having a first diameter smaller than a diameter of the stage heater.

17. The semiconductor processing tool of claim 16, where the arm lift is operable to move downward to lower the plurality of wafer lifts and the plurality of ring lifts, thus resting the first semiconductor wafer and adapter ring on a surface of the stage heater, the adapter ring covering a portion of the stage heater.

18. The semiconductor processing tool of claim 17, where the robotic arm is operable to remove the first semiconductor wafer from the plurality of wafer lifts and to remove the adapter ring from the plurality of ring lifts.

19. The semiconductor of processing tool of claim 18, where the robotic arm is operable to place a second semiconductor wafer on the plurality of wafer lifts, the second semiconductor wafer having a second diameter greater than the first diameter.

20. The semiconductor processing tool of claim 19, where the arm lift is operable to move downward to place the second semiconductor wafer on the surface of the stage heater.