Semiconductor matching layer in a layered ultrasound transducer array
First Claim
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1. In an ultrasound transducer array for medical diagnostic ultrasound imaging, an improvement comprising:
- an element having a first transducer layer, a capacitive membrane ultrasound transducer layer, and a semiconductor material composite matching layer.
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Abstract
A same transducer includes both piezoelectric and CMUT transducer layers. The semiconductor substrate used for the CMUT is also used as a matching layer. A portion of the semiconductor material is removed and the kerfs or voids are filled to provide the desired density, volume ratio, and/or acoustic impedance. This composite portion operates as a matching layer for the piezoelectric transducer layer.
46 Citations
20 Claims
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1. In an ultrasound transducer array for medical diagnostic ultrasound imaging, an improvement comprising:
an element having a first transducer layer, a capacitive membrane ultrasound transducer layer, and a semiconductor material composite matching layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for transducing between electrical and ultrasound energies, the system comprising:
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a first multi-dimensional array of first elements formed from piezoelectric material; and a second multi-dimensional array of second elements formed from semiconductor material, the second multi-dimensional array positioned at least partially covering a top of the first multi-dimensional array such that acoustic energy generated by the first multi-dimensional array propagates to a patient through the second multi-dimensional array; wherein the semiconductor material includes a composite portion with an acoustic impedance between a piezoelectric material acoustic impedance and a patient acoustic impedance. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A method for generating ultrasound imaging information with a transducer, the method comprising:
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transmitting acoustic energy through a layer of semiconductor substrate; adjusting an acoustic impedance for the transmitting with a composite matching layer portion of the semiconductor substrate, the adjusted acoustic impedance being closer to a patient acoustic impedance; receiving acoustic echoes responsive to the transmitting at the layer of semiconductor substrate; and converting the acoustic echoes to electrical energy by one or more transducers formed in or on the semiconductor substrate. - View Dependent Claims (19, 20)
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Specification