Method and system for measuring the fill level of a material

• US 20090093983A1
• Filed: 10/01/2008
• Published: 04/09/2009
• Est. Priority Date: 10/01/2007
• Status: Abandoned Application

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Trafford, Mark
• Application Number:
  US12/286,658
• Publication Number:
  US 20090093983A1
• Time in Patent Office: Days
• US Class Current: 702/100
• CPC Class Codes: G01F 23/284 Electromagnetic waves
• CPC Class Codes: G01F 23/2962 Measuring transit time of reflected waves

Abstract

It is described a method to measure a fill level of a material by transmitting an ultrasonic or microwave signal towards a surface of the material using a level gauge arranged above the material surface, receiving in said level gauge an ultrasonic or microwave signal portion reflected from said material surface, measuring a temperature at least one measurement point between the level gauge and the material surface and determining in a calculation unit of the level gauge a temperature-corrected value of the fill level based on the time delay of the received signal portion with respect to the emitted signal and the measured temperature. To provide an improved level measuring method and system with increased reactivity and accuracy in compensating temperature variations at least one non-contact infrared thermometer is used to measure the temperature.

Claims

1-12. -12. (canceled)

13. A method for measuring the fill level of a material comprising:

transmitting an ultrasonic or microwave signal towards a surface of the material using a level gauge arranged above the material surface;

receiving in said level gauge an ultrasonic or microwave signal portion reflected from said material surface;

measuring a temperature at least one measurement point between the level gauge and the material surface; and

determining in a calculation unit of the level gauge a temperature-corrected value of the fill level based on the time delay of the received signal portion with respect to the emitted signal and the measured temperature, wherein in at least one non-contact infrared thermometer is used to measure the temperature.

14. The method according to claim 13, wherein the infrared thermometer is directed to the material surface.

15. The method according to claim 13, wherein the infrared thermometer or another non-contact infrared thermometer is directed to at least one temperature target arranged in the space between the level gauge and the material surface.

16. The method according to claim 14, wherein the infrared thermometer or another non-contact infrared thermometer is directed to at least one temperature target arranged in the space between the level gauge and the material surface.

17. The method according to claim 15, wherein a low mass black body target is used as the temperature target.

18. The method according to claim 16, wherein a low mass black body target is used as the temperature target.

19. The method according to claim 13, wherein the infrared thermometer is arranged and used to successively scan different measurement points from the level gauge to the material surface.

20. The method according to claim 13, wherein the infrared thermometer is arranged and used to image a target area between the level gauge and the material surface onto an infrared sensor array.

21. A system for measuring the fill level of a material comprising:

a level gauge arranged above the material surface for transmitting an ultrasonic or microwave signal towards a surface of the material and for receiving in said level gauge an ultrasonic or microwave signal portion reflected from said material surface;

a temperature sensing device for measuring a temperature at least one measurement point between the level gauge and the material surface, wherein the temperature sensing device is operatively connected to said level gauge; and

a calculation unit for determining a temperature-corrected value of the fill level based on the time delay of the received signal portion with respect to the emitted signal and the measured temperature, wherein said temperature sensing device has at least one non-contact infrared thermometer.

22. The system according to claim 21, wherein the calculation unit is a part of the level gauge.

23. The system according to claim 21, wherein the infrared thermometer is directed to the material surface.

24. The system according to claim 21, wherein the infrared thermometer or another non-contact infrared thermometer is directed to at least one temperature target arranged in the space between the level gauge and the material surface.

25. The system according to claim 24, wherein the temperature target comprises a low mass black body target.

26. The system according to claim 21, wherein the infrared thermometer is arranged to successively scan different measurement points from the level gauge to the material surface.

27. The system according to claim 22, wherein the infrared thermometer is arranged to successively scan different measurement points from the level gauge to the material surface.

28. The system according to claim 23, wherein the infrared thermometer is arranged to successively scan different measurement points from the level gauge to the material surface.

29. The system according to claim 24, wherein the infrared thermometer is arranged to successively scan different measurement points from the level gauge to the material surface.

30. The system according to claim 25, wherein the infrared thermometer is arranged to successively scan different measurement points from the level gauge to the material surface.

31. The system according to claim 21, wherein the infrared thermometer has an infrared sensor array and device for imaging a target area between the level gauge and the material surface onto the sensor array.

32. The system according to claim 23, wherein the infrared thermometer has an infrared sensor array and device for imaging a target area between the level gauge and the material surface onto the sensor array.