Method and apparatus for PCB finishing processes
First Claim
Patent Images
1. An apparatus for printing printed circuit boards (PCBs) comprising:
- a solder mask printing susbystem;
a legend printing susbystem;
at least one drying mechanism;
a PCB handling mechanism for handling the position, orientation, and movement of PCBs within said apparatus; and
a housing enclosing at least said solder mask printing susbystem, said legend printing susbystem, said at least one drying mechanism and said handling mechanism.
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Accused Products
Abstract
An apparatus for printing PCBs includes both solder mask ink and notation ink printing subsystems within the same unit. Notation ink and solder mask ink may be applied by a single apparatus or by separate apparatuses, such as an ink jet printer, and may be dried by a single drying mechanism or by separate drying mechanisms. The apparatus may also be equipped with a flipping station to allow dual-sided printing and/or a curing station to complete the PCB printing process.
7 Citations
20 Claims
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1. An apparatus for printing printed circuit boards (PCBs) comprising:
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a solder mask printing susbystem; a legend printing susbystem; at least one drying mechanism; a PCB handling mechanism for handling the position, orientation, and movement of PCBs within said apparatus; and a housing enclosing at least said solder mask printing susbystem, said legend printing susbystem, said at least one drying mechanism and said handling mechanism. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus for printing printed circuit boards (PCBs) comprising:
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solder mask printing susbystem; legend printing susbystem; a first drying mechanism for drying solder mask ink; a second drying mechanism for drying legend ink; a mechanism for handling the position, orientation, and movement of PCBs within said apparatus, and from said first printing station to a second printing station; and a housing enclosing at least said solder mask printing susbystem, said legend printing susbystem, said first and second drying mechanisms and said handling mechanism. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for printing solder mask and legend ink on printed circuit boards (PCBs) comprising:
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loading a PCB into a housing enclosing at least a solder mask printing subsystem, a legend printing subsystem and at least one drying mechanism, applying solder mask using said solder mask printing subsystem; applying legend ink using said legend printing subsystem; drying said PCB using said drying mechanism; and unloading said PCB from said housing. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification