EMC SHIELDING FOR PRINTED CIRCUITS USING FLEXIBLE PRINTED CIRCUIT MATERIALS
First Claim
1. A method for making multilayer flexible printed circuit carrier comprising:
- producing a first flexible conductor layer having a first width;
producing a second flexible conductor layer having a second width larger than the first width;
separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator;
placing a second insulator over at least a portion of a second surface of the first flexible conductor; and
wrapping a portion of the second flexible conductor over at least a portion of the second surface of the first flexible conductor.
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Accused Products
Abstract
Exemplary embodiments of the present invention relate to a method for making multilayer flexible printed circuit carrier. The method comprises producing a first flexible conductor layer having a first width, producing a second flexible conductor layer having a second width larger than the first width, and separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator. The method also comprises placing a second insulator over at least a portion of a second surface of the first flexible conductor, and wrapping a portion of the second flexible conductor over the at least a portion of the second surface of the first flexible conductor.
19 Citations
2 Claims
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1. A method for making multilayer flexible printed circuit carrier comprising:
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producing a first flexible conductor layer having a first width; producing a second flexible conductor layer having a second width larger than the first width; separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator; placing a second insulator over at least a portion of a second surface of the first flexible conductor; and wrapping a portion of the second flexible conductor over at least a portion of the second surface of the first flexible conductor.
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2. A multilayer flexible printed circuit carrier produced by:
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producing a first flexible conductor layer having a first width; producing a second flexible conductor layer having a second width larger than the first width; separating a first side of the first flexible conductor and a first side of the second flexible conductors with a first insulator; placing a second insulator over at least a portion of a second surface of the first flexible conductor; and wrapping a portion of the second flexible conductor over at least a portion of the second surface of the first flexible conductor.
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Specification