PACKAGE STRUCTURE OF LIGHT EMITTING DIODE AND METHOD OF MANUFACTURING THE SAME

• US 20090289274A1
• Filed: 03/23/2007
• Published: 11/26/2009
• Est. Priority Date: 03/23/2006
• Status: Abandoned Application

• Current Assignee: Wisepower Co., Ltd.
• Original Assignee: Sailux, Inc.
• Inventors: Park, Byoung Jae
• Application Number:
  US12/293,423
• Publication Number:
  US 20090289274A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Provided are a LED package structure and a method of manufacturing the same. The LED package structure includes first and second plate-shaped auxiliary support pieces; a heat-dissipating portion formed upwardly higher than the first and second auxiliary support pieces; a plurality of auxiliary leads connected between each of the auxiliary support pieces and a side surface of the heat-dissipating portion, a portion of each of the plurality of auxiliary leads adjacent to the heat-dissipating portion extending along the same level with the top surface of the heat-dissipating portion; and main leads extending from the auxiliary support pieces to the heat-dissipating portion along the same level with the top surface of the auxiliary leads and spaced apart from the heat-dissipating portion, wherein the heat-dissipating portion, the auxiliary support pieces and the main leads are integrally formed using a conductive metallic material. According to the LED package structure, connection leads are integrally formed with a heat-dissipating portion through perforating or bending a metal plate whose central part is thicker than its peripheral part, followed by molding and cutting process, thereby facilitating and simplifying the manufacturing process.

Claims

1. A light emitting diode (LED) package structure comprising:

first and second plate-shaped auxiliary support pieces each having a first thickness;

a heat-dissipating portion used to mount a light emitting diode chip and formed upwardly higher than the first and second auxiliary support pieces at the center of the first and second auxiliary support pieces, the heat-dissipating portion having a second thickness greater than the first thickness;

a plurality of auxiliary leads having the same thicknesses as the auxiliary support pieces and connected between each of the auxiliary support pieces and a side surface of the heat-dissipating portion, a portion of each of the plurality of auxiliary leads adjacent to the heat-dissipating portion extending along the same level with the top surface of the heat-dissipating portion; and

main leads having the same thicknesses as the auxiliary support pieces, extending from the auxiliary support pieces to the heat-dissipating portion along the same level with the top surface of the auxiliary leads, a portion of each main lead adjacent to the heat-dissipating portion extending along the same level with the top surface of the heat-dissipating portion to be spaced apart from the heat-dissipating portion,

wherein the heat-dissipating portion, the auxiliary support pieces and the main leads are integrally formed using a conductive metallic material.

2. The LED package structure of claim 1, wherein the auxiliary leads and the main leads are respectively configured to have first horizontal portions extending from the heat-dissipating portion along the same level with the top surface of the heat-dissipating portion by a predetermined length, vertical portions bent downward from the first horizontal portions, and second horizontal portions extending from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion to then be connected to the auxiliary support pieces.

3. The LED package structure of claim 2, further comprising a chip mounting portion whose inner diameter gradually decreases toward a lower position at the center of the heat-dissipating portion to mount the LED chip.

4. The LED package structure of claim 3, further comprising a molding cap including portions of the auxiliary leads and the main leads in view of the heat-dissipating portion, wherein the molding cap is formed through molding such that the bottom surface of the heat-dissipating portion, parts of the top surface of the first horizontal portions of the main leads, and the chip mounting portion are exposed outside.

5. A method of manufacturing a light emitting diode (LED) package structure, the method comprising:

forming auxiliary leads and main leads by performing a perforating process on a base frame having a base portion with a first thickness and a heat-dissipating portion extending downwardly from the base portion and having a second thickness greater than the first thickness at the center of the base portion, the perforating process performed on the base portion of the base frame, the auxiliary leads each connected between opposite ends of the base portion and the heat-dissipating portion, and the main leads each having one end isolated from the heat-dissipating portion and the other end connected to the end of the base portion; and

forming structures of the auxiliary leads and main leads such that first horizontal portions extend from the heat-dissipating portion along the same level with the top surface of the heat-dissipating portion by a predetermined length, vertical portions are bent downward from the first horizontal portions, and second horizontal portions extending from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion.

6. The method of claim 5, further comprising forming a chip mounting portion whose inner diameter gradually decreases toward a lower position at the center of the heat-dissipating portion.

7. The method of claim 6, further comprising forming a molding cap including a portion of the heat-dissipating portion and portions of the auxiliary leads and the main leads, the molding cap formed through molding such that the first horizontal portions of the main leads and the chip mounting portion are exposed outside.

8. The method of claim 7, further comprising cutting the main leads and the auxiliary leads exposed outside from the molding cap.

9. A method of manufacturing a light emitting device, the method comprising:

forming auxiliary leads and main leads by performing a perforating process on a base frame having a base portion with a first thickness and a heat-dissipating portion extending downwardly from the base portion and having a second thickness greater than the first thickness, the base frame having a chip mounting portion formed at the center of its top surface, the perforating process performed on the base portion of the base frame, the auxiliary leads each connected between opposite ends of the base portion and the heat-dissipating portion, and the main leads each having one end isolated from the heat-dissipating portion and the other end connected to the end of the base portion;

forming a molding cap including a portion of the heat-dissipating portion and portions of the auxiliary leads and the main leads, the molding cap formed through molding such that the main lead portion adjacent to the heat-dissipating portion and the chip mounting portion are exposed outside together; and

forming structures of the auxiliary leads and main leads such that first horizontal portions extend along the same level with the top surface of heat-dissipating portion to be spaced apart from the molding cap by a predetermined distance, vertical portions are bent downward from the first horizontal portions, and second horizontal portions extend from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion.

10. A method of manufacturing a light emitting device, the method comprising:

forming auxiliary leads and main leads by performing a perforating process on a base frame having a base portion with a first thickness and a heat-dissipating portion extending downwardly from the base portion and having a second thickness greater than the first thickness, the base frame having a chip mounting portion formed at the center of its top surface, the perforating process performed on the base portion of the base frame, the auxiliary leads each connected between opposite ends of the base portion and the heat-dissipating portion, and the main leads each having one end isolated from the heat-dissipating portion and the other end connected to the end of the base portion;

forming structures of the auxiliary leads and main leads such that first horizontal portions extend from the heat-dissipating portion along the same level with the top surface of the heat-dissipating portion by a predetermined length, vertical portions are bent downward from the first horizontal portions, and second horizontal portions extend from distal ends of the vertical portions along the same level with the bottom surface of the heat-dissipating portion;

forming a molding cap including a portion of the heat-dissipating portion and portions of the auxiliary leads and the main leads, the molding cap formed through molding such that the first horizontal portions extending along the same level with the top surface of the heat-dissipating portion and the chip mounting portion are partially exposed outside from the vertical portions together with the chip mounting portion; and

mounting a light emitting diode (LED) chip on the chip mounting portion and wire-bonding the LED chip and the first horizontal portions of the main leads to each other.