Optical Cup For Lighting Module

• US 20100067240A1
• Filed: 09/16/2008
• Published: 03/18/2010
• Est. Priority Date: 09/16/2008
• Status: Abandoned Application

• Current Assignee: OSRAM Sylvania Inc. (Ams-Osram AG)
• Original Assignee: OSRAM Sylvania Inc. (Ams-Osram AG)
• Inventors: SELVERIAN, John, Scotch, Adam M., Hamby, David
• Application Number:
  US12/211,334
• Publication Number:
  US 20100067240A1
• Time in Patent Office: Days
• US Class Current: 362/350
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 7/26 the material comprising photoluminescent substances
• CPC Class Codes: F21V 9/38 Combination of two or more photoluminescent elements of different materials
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 19/0014 at least one surface having optical power
• CPC Class Codes: G02B 19/0019 having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
• CPC Class Codes: G02B 19/0028 refractive and reflective surfaces, e.g. non-imaging catadioptric systems
• CPC Class Codes: G02B 19/0061 the light source comprising a LED semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission H01L33/00
• CPC Class Codes: G02B 19/0066 in the form of an LED array
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A lighting module comprising a base panel and a plurality of light-emitting diode (LED) chips attached directly to the base panel. The LED chips are in electrical communication with conductive traces on the base panel, which deliver a current to the LED chips. Various embodiments of this generally described lighting module are also presented. Additionally, methods of preparing such a lighting module, and system components of the lighting module are presented.

Claims

1. An optical cup for use in a lighting module, comprising:

a lower surface;

a peripheral wall extending upward from the lower surface;

a lip region formed along the peripheral wall; and

an angled inner surface extending from the lip region to the lower surface so as to form a central opening in the optical cup.

2. The optical cup of claim 1, further comprising a reflective coating on the angled inner surface.

3. The optical cup of claim 1, further comprising at least one cut-out region in the peripheral wall.

4. The optical cup of claim 1, further comprising three cut-out regions in the peripheral wall.

5. The optical cup of claim 1, further comprising means for eliminating bubbles from forming on the lower surface of the optical cup when the optical cup is attached to a substrate.

6. The optical cup of claim 1, further comprising an optical disk disposed within the optical cup adjacent to the lip region.

7. The optical cup of claim 1, further comprising means for converting light emitted from a light-emitting diode chip to white light.

8. The optical cup of claim 1, further comprising means for affecting the light emitted from a light-emitting diode chip.

9. The optical cup of claim 1, wherein the central opening of the optical cup has a diameter of about 1.0 mm

10. The optical cup of claim 1, wherein a height of the optical cup is about 1.7 mm.

11. A lighting module, comprising:

a base panel;

a light-emitting diode chip attached directly to the base panel and in electrical communication with a conductive trace on the base panel, wherein the light-emitting diode emits light;

an optical cup surrounding the light-emitting diode chip; and

means for effecting the light emitted from the light-emitting diode chip.