DISK DRIVE SUSPENSION VIA FORMATION USING A TIE LAYER AND PRODUCT

• US 20100230144A1
• Filed: 01/26/2006
• Published: 09/16/2010
• Est. Priority Date: 09/09/2005
• Status: Active Grant

• Current Assignee: Hutchinson Technology Incorporated (TDK Corporation)
• Original Assignee: Magnecomp Corporation (TDK Corporation)
• Inventors: Dunn, Christopher, Schreiber, Christopher
• Granted Patent: US 7,781,679 B1
• Time in Patent Office: Days
• US Class Current: 174/257
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09554 Via connected to metal substrate
• CPC Class Codes: H05K 2201/09827 Tapered, e.g. tapered hole, via or groove bevelled, chamferred or tapered edge H05K2201/09154
• CPC Class Codes: H05K 3/16 by cathodic sputtering
• CPC Class Codes: H05K 3/4076 by thin-film techniques
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Claims

1-45. -45. (canceled)

46. A disk drive suspension interconnect comprising a stainless steel grounding layer, a synthetic organic polymer layer on the stainless steel grounding layer, the synthetic organic polymer layer having an aperture therethrough, the synthetic organic polymer layer having walls defining the aperture therethrough, the organic polymer layer walls having wall slopes of less than 90 degrees, a chromium layer sputtered directly onto the stainless steel grounding layer within the aperture for facilitating an electrical contact to the stainless steel grounding layer within the aperture, a metal conductive layer bonded to the sputtered chromium layer within the aperture, an electrodeposited copper layer on the synthetic organic polymer layer and the metal conductive layer, and a circuit component electrically connected to the electrodeposited copper layer, the sputtered chromium layer and the metal conductive layer being disposed at least partially within the aperture of the synthetic organic polymer layer, the aperture being substantially filled with metal without the need for conductive adhesive within the aperture, the chromium layer and the metal conductive layer and the electrodeposited copper layer together providing an electrical ground path from the electrical component to the stainless steel grounding layer thereby grounding the electrical component to the stainless steel grounding layer.

47. The disk drive suspension interconnect according to claim 46, in which said synthetic organic polymer comprises polyimide.

48. The disk drive suspension interconnect according to claim 46, in which said metal conductive layer comprises copper.

49. The disk drive suspension interconnect according to claim 46, including also a seed layer comprising copper within said aperture.

50. The disk drive suspension interconnect according to claim 46, in which said circuit component comprises a slider.

51. The disk drive suspension interconnect according to claim 46, wherein the aperture wall slopes are less than 85 degrees.

52. The disk drive suspension interconnect according to claim 46, wherein the aperture wall slopes are between 50 and 85 degrees.

53. A disk drive suspension interconnect comprising a stainless steel grounding layer, an insulative layer on the stainless steel grounding layer, the insulative layer having an aperture therethrough, a Monel metal layer sputtered directly onto the stainless steel grounding layer within the aperture for facilitating an electrical contact to the stainless steel grounding layer within the aperture, a metal conductive layer bonded to the sputtered Monel layer within the aperture, an electrodeposited copper layer on the insulative layer and on the metal conductive layer, and a circuit component electrically connected to the electrodeposited copper layer, the sputtered Monel layer and the metal conductive layer being disposed at least partially within the aperture of the insulative layer, the aperture being substantially filled with metal without the need for conductive adhesive within the aperture, the Monel layer and the metal conductive layer and the electrodeposited copper layer together providing an electrical ground path from the electrical component to the stainless steel grounding layer thereby grounding the electrical component to the stainless steel grounding layer.

54. The disk drive suspension interconnect according to claim 53, further comprising a gold layer on the electrodeposited copper layer.

55. The disk drive suspension interconnect according to claim 53, wherein the insulative layer is polyester.

56. The disk drive suspension interconnect according to claim 53, wherein the insulative layer is polyimide.

57. The disk drive suspension interconnect according to claim 53, wherein the insulative layer has walls defining the aperture therethrough, the walls having wall slopes of less than 90 degrees.

58. The disk drive suspension interconnect according to claim 57 wherein the wall slopes are less than 85 degrees.

59. The disk drive suspension interconnect according to claim 57, wherein the wall slopes are between 60 and 85 degrees.

60. A disk drive suspension interconnect comprising a stainless steel grounding layer, a synthetic organic polymer layer on the stainless steel grounding layer, the synthetic organic polymer layer having an aperture therethrough, the synthetic organic polymer layer having walls defining the aperture therethrough, the organic polymer layer walls having wall slopes of between 60 and 85 degrees, a chromium layer sputtered directly onto the stainless steel grounding layer within the aperture for facilitating an electrical contact to the stainless steel grounding layer within the aperture, a metal conductive layer bonded to the sputtered chromium layer within the aperture, an electrodeposited copper layer on the synthetic organic polymer layer and on the metal conductive layer, and a circuit component electrically connected to the electrodeposited copper layer, the sputtered chromium layer and the metal conductive layer being disposed at least partially within the aperture of the synthetic organic polymer layer, the aperture being substantially filled with metal without the need for conductive adhesive within the aperture, the chromium layer and the metal conductive layer and the electrodeposited copper layer together providing an electrical ground path from the electrical component to the stainless steel grounding layer thereby grounding the electrical component to the stainless steel grounding layer.

61. The disk drive suspension interconnect of claim 60 wherein the metal conductive layer comprises a copper seed layer.

62. The disk drive suspension interconnect of claim 61 further comprising a flash plated copper layer flash plated on the copper seed layer, the flash plated copper layer having a thickness of between 1 μ

m and 5 μ

m.

63. The disk drive suspension interconnect of claim 60 wherein the electrodeposited copper substantially fills the aperture.

64. The disk drive suspension interconnect of claim 60 where the metal conductive layer has a thickness of between 100 Å

and 800 Å

.

65. The disk drive suspension interconnect according to claim 60, wherein the aperture wall slopes are about 75 degrees.