Sea of Pillars

• US 20100239751A1
• Filed: 03/22/2010
• Published: 09/23/2010
• Est. Priority Date: 03/23/2009
• Status: Abandoned Application

• Current Assignee: Sonavation, Inc.
• Original Assignee: Sonavation, Inc.
• Inventors: Regniere, Louis
• Application Number:
  US12/728,918
• Publication Number:
  US 20100239751A1
• Time in Patent Office: Days
• US Class Current: 427/100
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/852 Composite materials, e.g. having 1-3 or 2-2 type connectivity
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

Provided is a method for manufacturing multiple devices on a single piezoelectric composite substrate. The piezoelectric composite substrate is significantly larger than a size required for a single device, thus multiple sensors can be simultaneously fabricated from the same piezoelectric composite substrate.

Claims

1. A method for near simultaneously creating multiple devices on a single piezoelectric composite substrate, comprising:

depositing first type patterns on a first side of the substrate, the first type patterns being aligned with a first direction;

depositing second type patterns on a second side of the substrate, the second type patterns being aligned with a second direction;

wherein each of the first type patterns functionally corresponds with one of the second type patterns to form a corresponding pair; and

singulating the corresponding pairs within the substrate.

2. The method of claim 1, wherein the first type patterns are deposited lithographically.

3. The method of claim 1, wherein the second type patterns are deposited lithographically.

4. The method of claim 1, wherein each of the first type patterns overlaps with its corresponding second type pattern.

5. The method of claim 1, wherein the functional correspondence includes an electrical connection.

6. The method of claim 1, wherein each corresponding pair represents one of the multiple devices.

7. The method of claim 1, wherein each corresponding pair represents a biometric sensor.