METHOD AND SYSTEM FOR AN ON-CHIP LEAKY WAVE ANTENNA

• US 20100309075A1
• Filed: 03/31/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/751,768
• Publication Number:
  US 20100309075A1
• Time in Patent Office: Days
• US Class Current: 343/772
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for an on-chip leaky wave antenna (LWA) are disclosed and may include communicating RF signals using one or more LWAs in a wireless device. The LWAs may be integrated in metal layers in an integrated circuit (chip) in the wireless device. The RF signals may be communicated to devices external to the chip via a desired angle from the surface of the chip, or may be communicated between regions within the chip. The LWAs may comprise microstrip waveguides where a cavity height of the LWAs may be controlled by configuring a spacing between conductive lines in the microstrip waveguides. The LWAs may include coplanar waveguides where a cavity height of the leaky wave antennas may be controlled by configuring a spacing between conductive lines in the coplanar waveguides. The chip may be flip-chip-bonded to an integrated circuit package which may be affixed to a printed circuit board.

Claims

1. A method for communication, the method comprising:

communicating RF signals via one or more leaky wave antennas in a wireless device, wherein said one or more leaky wave antennas are integrated in metal layers in an integrated circuit in said wireless device.

2. The method according to claim 1, comprising communicating said RF signals to devices external to said integrated circuit via a surface of said integrated circuit.

3. The method according to claim 2, comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from said surface of said integrated circuit.

4. The method according to claim 1, comprising communicating said RF signals between regions within said integrated circuit.

5. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

6. The method according to claim 5, comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said microstrip waveguides.

7. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

8. The method according to claim 7, comprising configuring a cavity height of said leaky wave antennas by controlling spacing between conductive lines in said coplanar waveguides.

9. The method according to claim 1, wherein said integrated circuit is flip-chip-bonded to an integrated circuit package.

10. The method according to claim 9, wherein said integrated circuit package is affixed to a printed circuit board.

11. A system for enabling communication, the system comprising:

one or more circuits in an integrated circuit for use in a wireless device, said integrated circuit comprising one or more leaky wave antennas, wherein;

said one or more leaky wave antennas are integrated in metal layers in said integrated circuit; and

said one or more circuits are operable to communicate RF signals via said one or more leaky wave antennas in said integrated circuit.

12. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals to devices external to said integrated circuit via a surface of said integrated circuit.

13. The system according to claim 12, wherein said one or more circuits are operable to configure said leaky wave antennas to transmit said wireless signals at a desired angle from said surface of said integrated circuit.

14. The system according to claim 11, wherein said one or more circuits are operable to communicate said RF signals between regions within said integrated circuit.

15. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

16. The system according to claim 15, wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling a spacing between conductive lines in said microstrip waveguides.

17. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

18. The system according to claim 17, wherein said one or more circuits are operable to configure a cavity height of said leaky wave antennas by controlling a spacing between conductive lines in said coplanar waveguides.

19. The system according to claim 11, wherein said integrated circuit is flip-chip-bonded to an integrated circuit package.

20. The system according to claim 19, wherein said integrated circuit package is affixed to a printed circuit board.