METHOD AND SYSTEM FOR WIRELESS COMMUNICATION UTILIZING ON-PACKAGE LEAKY WAVE ANTENNAS

• US 20100311324A1
• Filed: 06/09/2010
• Published: 12/09/2010
• Est. Priority Date: 06/09/2009
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Application Number:
  US12/797,068
• Publication Number:
  US 20100311324A1
• Time in Patent Office: Days
• US Class Current: 455/39
• CPC Class Codes: G01S 13/06 Systems determining position data of a target
• CPC Class Codes: G06K 7/10316 using at least one antenna particularly designed for interrogating the wireless record carriers antennas in general H01Q1/22
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H01Q 13/20 Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
• CPC Class Codes: H01Q 13/22 Longitudinal slot in boundary wall of waveguide or transmission line H01Q13/203 takes precedence
• CPC Class Codes: H01Q 15/006 Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
• CPC Class Codes: H01Q 15/0066 said selective devices being reconfigurable, tunable or controllable, e.g. using switches
• CPC Class Codes: H01Q 15/23 Combinations of reflecting surfaces with refracting or diffracting devices
• CPC Class Codes: H01Q 19/06 using refracting or diffracting devices, e.g. lens radome H01Q1/42
• CPC Class Codes: H04B 1/0458 Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages matching circuits in general H03H
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 7/24 for communication between two or more posts wireless communication networks H04W

Abstract

Methods and systems for wireless communication utilizing on-package leaky wave antennas (LWAs) are disclosed and may include communicating wireless signals via an RF digital bus between integrated circuit packages in a wireless device utilizing LWAs integrated in metal layers in the plurality of packages. A resonant frequency of the LWAs may be configured utilizing micro-electro-mechanical systems (MEMS) deflection. A plurality of the LWAs may be configured to enable beam-forming. The LWAs may include microstrip or coplanar waveguides wherein a cavity height of the LWAs is dependent on spacing between conductive lines in the waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle from a surface of the packages. The packages may be affixed to one or more printed circuit boards. An integrated circuit may be flip-chip-bonded to one or more of the packages.

Claims

1. A method for communication, the method comprising:

communicating wireless signals via a radio frequency (RF) digital bus between integrated circuit packages in a wireless device utilizing leaky wave antennas integrated in one or more metal layers in said plurality of integrated circuit packages.

2. The method according to claim 1, comprising configuring a resonant frequency of said leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

3. The method according to claim 1, comprising configuring a plurality of said leaky wave antennas to enable beam-forming.

4. The method according to claim 1, wherein said leaky wave antennas comprise microstrip waveguides.

5. The method according to claim 4, wherein a cavity height of said leaky wave antennas is dependent on spacing between conductive lines in said microstrip waveguides.

6. The method according to claim 1, wherein said leaky wave antennas comprise coplanar waveguides.

7. The method according to claim 6, wherein a cavity height of said leaky wave antennas is dependent on spacing between conductive lines in said coplanar waveguides.

8. The method according to claim 1, comprising configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit packages.

9. The method according to claim 1, wherein said integrated circuit packages are affixed to one or more printed circuit boards.

10. The method according to claim 1, wherein an integrated circuit is flip-chip-bonded to one or more of said integrated circuit packages.

11. A system for enabling communication, the system comprising:

in a wireless device comprising leaky wave antennas in a plurality of integrated circuit packages, said wireless device is operable to;

communicate wireless signals via a radio frequency (RF) digital bus between said integrated circuit packages utilizing said leaky wave antennas, wherein said leaky wave antennas are integrated in one or more metal layers in said plurality of integrated circuit packages.

12. The system according to claim 11, wherein said wireless device is operable to configure a resonant frequency of said leaky wave antennas utilizing micro-electro-mechanical systems (MEMS) deflection.

13. The system according to claim 11, wherein said wireless device is operable to configure a plurality of said leaky wave antennas to enable beam-forming.

14. The system according to claim 11, wherein said leaky wave antennas comprise microstrip waveguides.

15. The system according to claim 14, wherein a cavity height of said leaky wave antennas is dependent on spacing between conductive lines in said microstrip waveguides.

16. The system according to claim 11, wherein said leaky wave antennas comprise coplanar waveguides.

17. The system according to claim 16, wherein a cavity height of said leaky wave antennas is dependent on spacing between conductive lines in said coplanar waveguides.

18. The system according to claim 11, wherein said wireless device is operable to configure configuring said leaky wave antennas to transmit said wireless signals at a desired angle from a surface of said integrated circuit packages.

19. The system according to claim 11, wherein said integrated circuit packages are affixed to one or more printed circuit boards.

20. The system according to claim 11, wherein an integrated circuit is flip-chip-bonded to one or more of said integrated circuit packages.