PHYSICAL QUANTITY SENSOR, MANUFACTURING METHOD OF PHYSICAL QUANTITY SENSOR, AND ELECTRONIC APPARATUS

• US 20110056296A1
• Filed: 09/01/2010
• Published: 03/10/2011
• Est. Priority Date: 09/07/2009
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: KANEMOTO, Kei
• Application Number:
  US12/873,527
• Publication Number:
  US 20110056296A1
• Time in Patent Office: Days
• US Class Current: 73/514.32
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A physical quantity sensor includes: a fixing part; an elastic deforming part; a movable weight part coupled to the fixing part via the elastic deforming part; a fixed arm part extended from the fixing part; and a movable arm part extended from the movable weight part and provided to face the fixed arm part via a gap, wherein the fixed arm part and the movable arm part are laminated structures containing insulating layers and conductor layers, the fixed arm part has a first side surface conductor film provided on a side surface of the fixed arm part and a first connecting electrode part using the conductor layer and electrically connected to the first side surface conductor film, and the movable arm part has a second side surface conductor film provided on aside surface opposed to the first side surface conductor film and a second connecting electrode part using the conductor layer and electrically connected to the second side surface conductor film.

Claims

1. A physical quantity sensor comprising:

a fixing part;

an elastic deforming part;

a movable weight part coupled to the fixing part via the elastic deforming part;

a fixed arm part extended from the fixing part; and

a movable arm part extended from the movable weight part and provided to face the fixed arm part via a gap,

wherein the fixed arm part and the movable arm part are laminated structures containing insulating layers and conductor layers,

the fixed arm part has a first side surface conductor film provided on a side surface of the fixed arm part and a first connecting electrode part using the conductor layer and electrically connected to the first side surface conductor film, and

the movable arm part has a second side surface conductor film provided on a side surface opposed to the first side surface conductor film and a second connecting electrode part using the conductor layer and electrically connected to the second side surface conductor film.

2. The physical quantity sensor according to claim 1, wherein the first connecting electrode part and the second connecting electrode part are provided within the insulating layers.

3. The physical quantity sensor according to claim 2, wherein a contact hole is provided in the fixed arm part or the movable arm part, and

the first connecting electrode part and the first side surface conductor film or the second connecting electrode part and the second side surface conductor film are connected via the contact hole.

4. The physical quantity sensor according to claim 1, wherein an integrated circuit part is provided in the fixing part, and

the first connecting electrode part and the second connecting electrode part are connected to the integrated circuit part.

5. The physical quantity sensor according to claim 1, wherein one of the first connecting electrode part and the second connecting electrode part is grounded.

6. An electronic apparatus comprising the physical quantity sensor according to claim 1.

7. A manufacturing method of a physical quantity sensor, comprising:

forming a laminated structure using an insulating layer and a conductor layer on a substrate;

etching the laminated structure to form a fixing part, a movable weight part, an elastic deforming part that couples the fixing part and the movable weight part, a fixed arm part extending from the fixing part, and a movable arm part extending from the movable weight part;

forming a first side surface conductor film on a side surface of the fixed arm part and a second side surface conductor film on a side surface of the movable arm part;

connecting a first connecting electrode part formed using the conductor layer of the fixed arm part and the first side surface conductor film, and connecting a second connecting electrode part formed using the conductor layer of the movable arm part and the second side surface conductor film; and

etching the substrate to form gaps between the respective movable weight part, movable arm part, elastic deforming part and the substrate.

8. The manufacturing method of a physical quantity sensor according to claim 7, wherein the first side surface conductor film and the second side surface conductor film are formed by ionization PVD or long-throw sputtering.

9. The manufacturing method of a physical quantity sensor according to claim 7, further comprising:

forming the first connecting electrode part and the second connecting electrode part within the insulating layer, and forming a contact hole to expose at least a part of surfaces of the first connecting electrode part and the second connecting electrode part; and

forming electrodes on an inner wall surface of the contact hole, a surface of the fixed arm part, and a surface of the movable arm part, and connecting the first connecting electrode part and the first side surface conductor film and connecting the second connecting electrode part and the second side surface conductor film.