Configuration of Multiple LED Module

• US 20110095311A1
• Filed: 01/04/2011
• Published: 04/28/2011
• Est. Priority Date: 10/16/2000
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Späth, Werner, Marchl, Werner, Waitl, Günter
• Granted Patent: US 8,113,688 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.

Claims

1. An LED module, comprising:

a carrier having a first main area, a second main area, and at least one semiconductor layer comprising a semiconductor material, said first main area having a planar configuration;

a plurality of conductive regions formed on said first main area of said carrier;

a plurality of LED semiconductor bodies applied on said plurality of conductive regions; and

a frame-like structure being formed on said first main area and enclosing the conductive regions.

2. The LED module according to claim 1, wherein said frame-like structure forms a trough-like reservoir.

3. The LED module according to claim 2, wherein the trough-like reservoir is formed around each conductive region.

4. The LED module according to claim 1, wherein said frame-like structure is formed in elevated fashion.

5. The LED module according to claim 1, wherein said frame-like structure partly covers said plurality of conductive regions.

6. The LED module according to claim 1, wherein said frame-like structure comprises a plastic.

7. The LED module according to claim 1, wherein said carrier has and is bounded by at least one electrical insulating layer on a side of said first main area, said conductive regions being arranged on the insulating layer.

8. The LED module according to claim 7, wherein said electrical insulating layer is formed in a multilayered fashion.

9. The LED module according to claim 1, wherein said semiconductor layer contains a material selected from the group consisting of silicon and gallium arsenide.

10. The LED module according to claim 1, wherein said conductive regions have a high reflectivity in a spectral region of radiation emitted by said LED semiconductor bodies.

11. The LED module according to claim 7, wherein said conductive regions are formed from aluminum.

12. The LED module according to claim 1, further comprising chip connection regions formed on said conductive regions and said LED semiconductor bodies are disposed on said chip connection regions.

13. The LED module according to claim 12, wherein each of said chip connection regions are formed as a stack of thin metal layers.

14. The LED module according to claim 13, wherein said thin metal layers contain materials selected from the group consisting of titanium, copper, gold, platinum and other noble metals.

15. The LED module according to claim 1, further comprising a heat sink connected to said carrier on said second main area.

16. The LED module according to claim 15, wherein said heat sink is formed of a material selected from the group consisting of copper and aluminum.

17. The LED module according to claim 15, wherein said heat sink adjoins said semiconductor layer.

18. The LED module according to claim 15, further comprising a soldering compound connecting said heat sink to said semiconductor layer.

19. The LED module according to claim 1, wherein said LED semiconductor bodies are disposed on said carrier in a matrix form.

20. The LED module according to claim 1, wherein said LED semiconductor bodies emit light of differing central wavelengths during operation.

21. The LED module according to claim 20, wherein the light emitted by individual ones of said LED semiconductor bodies during operation has central wavelengths in the red, green or blue spectral region.

22. The LED module according to claim 19, wherein said LED semiconductor bodies with a same central wavelength in each case are disposed regularly on said carrier.

23. The LED module according to claim 19, wherein said LED semiconductor bodies are disposed in a periodically recurring sequence with regard to the central wavelengths in matrix rows.

24. The LED module according to claim 23, wherein a configuration of said LED semiconductor bodies in said matrix rows have a same periodically recurring sequence with regard to the central wavelengths.

25. The LED module according to claim 22, wherein said LED semiconductor bodies with a same central wavelength are in each case disposed in matrix columns.

26. The LED module according to claim 24, wherein a configuration of said LED semiconductor bodies in said matrix rows with an odd row number is identical and said configuration in said matrix rows with an even row number emerges from an overlying matrix row by displacement by one column width toward the left or toward the right.

27. The LED module according to claim 1, wherein said LED semiconductor bodies are one of soldered on and adhesively bonded on using an adhesion agent.

28. The LED module according to claim 27, wherein said adhesion agent is electrically conductive.

29. The LED module according to claim 27, wherein said adhesion agent is selected from the group consisting of a solder, an adhesive, and a silver conductive adhesive.

30. The LED module according to claim 15, further comprising a thermally conductive adhesive connecting said heat sink to said semiconductor layer.