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Controllable Placement of Liquid Adhesive on Substrate

  • US 20110151202A1
  • Filed: 12/18/2009
  • Published: 06/23/2011
  • Est. Priority Date: 12/18/2009
  • Status: Abandoned Application
First Claim
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1. A method comprising:

  • dispensing a liquid adhesive into a designated area on a surface of a substrate;

    controllably applying energy to at least a portion of the dispensed liquid adhesive in the designated area to confine the dispensed liquid adhesive to the designated area; and

    curing the confined liquid adhesive.

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