Radiation-Emitting Device and Method for Producing a Radiation-Emitting Device

• US 20110260201A1
• Filed: 07/21/2009
• Published: 10/27/2011
• Est. Priority Date: 07/25/2008
• Status: Active Grant

• Current Assignee: Pictiva Displays International Limited (f/k/a Dolya Holdco 5 Limited) (Key Patent Innovations Limited)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Ingle, Andrew, Klein, Markus, Schlenker, Tilman
• Granted Patent: US 8,772,818 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H10K 50/81 Anodes
• CPC Class Codes: H10K 50/813 characterised by their shape
• CPC Class Codes: H10K 50/816 Multilayers, e.g. transparent multilayers
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A radiation-emitting device is provided which comprises a substrate (10), at least one organic functional layer (100) on the substrate (10) and a second electrode (80) on the at least one organic functional layer (100). The substrate (10) includes a plastics film (1) and a metal film (3), and the metal film (3) is arranged between the plastics film (1) and the at least one organic functional layer (100) and is set up as a first electrode. A method is additionally provided for producing such a device.

Claims

1. A radiation-emitting device comprising:

a substrate;

at least one organic functional layer on the substrate; and

a second electrode on the at least one organic functional layer,

wherein the substrate includes a plastics film and a metal film, and the metal film is arranged between the plastics film and the at least one organic functional layer and is set up as a first electrode.

2. The radiation-emitting device according to claim 1, wherein the substrate is free of barrier layers.

3. The radiation-emitting device according to claim 1, wherein the substrate is flexible.

4. The radiation-emitting device according to claim 1, wherein the substrate has a larger lateral dimension than the at least one organic functional layer and the second electrode.

5. The radiation-emitting device according to claim 1, wherein the metal film is impermeable to diffusion and the plastics film is less impermeable to diffusion than the metal film.

6. The radiation-emitting device according to claim 1, wherein the metal film comprises at least two sub-layers.

7. The radiation-emitting device according to claim 1, wherein a planarisation layer is arranged between the plastics film and the metal film.

8. The radiation-emitting device according to claim 1, wherein a glass encapsulation and/or a thin-film encapsulation is arranged on the second electrode and on the substrate to encapsulate the at least one organic functional layer.

9. The radiation-emitting device according to claim 8, wherein a structured insulating layer is arranged between the glass encapsulation and/or thin-film encapsulation and the substrate.

10. A method of producing a flexible organic radiation-emitting device according to claim 1, comprising the steps of

A) providing a plastics film and a metal film to produce a substrate,

B) setting up the metal film (3) as the first electrode, and

C) arranging at least one organic functional layer and a second electrode on the substrate.

11. The method according to claim 10, wherein method step A) comprises:

A1) producing a plastics film; and

A2) arranging a metal film on the plastics film.

12. The method according to claim 11, wherein in method step A2) a material for the metal film is applied to the plastics film by vapour deposition or sputtering.

13. The method according to claim 11, wherein in a method step A3) between method steps A1) and A2) a planarisation layer is arranged on the plastics film.

14. The method according to claim 10, comprising a method step D), following on from method step C), in which the arrangement provided in method step C) is encapsulated by a glass encapsulation and/or thin-film encapsulation.

15. The method according to claim 14, wherein method step D) comprises the steps of:

D1) arranging a structured insulating layer on zones of the substrate which are not covered by the at least one organic functional layer; and

D2) arranging the glass encapsulation and/or thin-film encapsulation (400, 600) over the structured insulating layer and the second electrode.