Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks

• US 20110315556A1
• Filed: 08/09/2011
• Published: 12/29/2011
• Est. Priority Date: 05/07/2003
• Status: Abandoned Application

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Thomassian, Jill R., Lockard, Michael S., Kilgo, Marvin M. III, Frodis, Uri, Smalley, Dennis R.
• Application Number:
  US13/206,133
• Publication Number:
  US 20110315556A1
• Time in Patent Office: Days
• US Class Current: 205/118
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 1/20 Separation of the formed objects from the electrodes with no destruction of said electrodes
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/14 two or more layers being of nickel or chromium, e.g. duplex or triplex layers
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces
• CPC Class Codes: C25D 5/50 by heat-treatment

Abstract

Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Claims

1. A method for forming an alignment target on a substrate, comprising:

forming a first patternable mold material on the substrate;

patterning the first patternable mold material to form a first aperture;

forming a first material in the first aperture to form an alignment target within the first aperture;

removing the first patternable mold material;

forming a second patternable mold material on the substrate so as to cover the alignment target; and

forming the second patternable mold material to form a second aperture wider than and fully enclosing the alignment target.

2. The method of claim 1, further comprising forming a non-conductive material in the second aperture such that the alignment target is enclosed in the non-conductive material.

3. The method of claim 2, further comprising forming a non-adherent material over the non-conductive material.

4. The method of claim 1, wherein forming the first material in the aperture comprises forming the first material by electrodeposition.

5. The method of claim 2, wherein forming the non-conductive material comprises forming the non-conductive material by electrodeposition.

6. The method of claim 3, wherein forming the non-adherent material comprises forming the non-adherent material by electrodeposition.

7. The method of claim 2, wherein forming the non-conductive material comprises forming the non-conductive material by blanket depositing and etching the non-conductive material.

8. The method of claim 3, wherein forming the non-adherent material comprises forming the non-adherent material by depositing and etching the non-adherent material.

9. The method of claim 2, wherein forming the first material in the aperture comprises forming the first material by electrodeposition.

10. The method of claim 2, wherein forming the first material in the aperture comprises forming the first material by depositing and etching the non-adherent material.

11. A method for electroplating a layer of material on a substrate, comprising:

forming a conductive layer over a non-conductive surface of the substrate;

forming a target in the conductive layer such that the target is electrically isolated from the remainder of the conductive layer by the non-conductive surface of the substrate; and

electroplating the layer of material over the conductive layer such that the conductive layer is plated and the target is un-plated.

12. A method for patterning odd and even layers of patternable material formed sequentially on a substrate, comprising:

patterning the odd layers using first photomasks having a first layout of alignment shapes and new target shapes, the first layout having a first orientation relative to the substrate; and

patterning the even layers using second photomasks having a second layout of alignment shapes and new target shapes, the second layout having a second orientation relative to the substrate different from the first orientation.

13. The method of claim 12, wherein the second orientation is 180 degrees opposite the first orientation.