EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME

• US 20120024580A1
• Filed: 11/01/2010
• Published: 02/02/2012
• Est. Priority Date: 08/02/2010
• Status: Abandoned Application

• Current Assignee: Taiwan Union Technology Corporation
• Original Assignee: Taiwan Union Technology Corporation
• Inventors: HSU, Hsuan Hao, Huang, Jiun Jie, Chu, Mei Ling, Chen, Hsien Te
• Application Number:
  US12/917,202
• Publication Number:
  US 20120024580A1
• Time in Patent Office: Days
• US Class Current: 174/258
• CPC Class Codes: C08G 59/24 carbocyclic
• CPC Class Codes: C08G 59/4261 Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings C08G59/4253 takes precedence
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C09D 163/00 Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/012 Flame-retardant; Preventing of inflammation
• CPC Class Codes: H05K 3/0064 onto a polymeric substrate

Abstract

Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Claims

1. An epoxy resin composition, comprising:

(A) an epoxy resin comprising a dicyclopentadiene type epoxy resin represented by the following general formula (I);

2. The epoxy resin composition as claimed in claim 1, wherein the epoxy resin further comprises a bisphenol type epoxy resin.

3. The epoxy resin composition as claimed in claim 2, wherein the bisphenol type epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, or mixtures thereof.

4. The epoxy resin composition as claimed in claim 2, wherein the epoxy resin comprises 70 to 100 parts by weight of dicyclopentadiene type epoxy resin and 0 to 30 parts by weight of bisphenol type epoxy resin.

5. The epoxy resin composition as claimed in claim 1, wherein the copolymer of styrene and maleic anhydride has a molecular weight of 1400 to 50000.

6. The epoxy resin composition as claimed in claim 1, further comprising a curing accelerator.

7. The epoxy resin composition as claimed in claim 6, wherein the curing accelerator is present in an amount of 0.1 to 1 parts by weight, based on 100 parts by weight of the epoxy resin.

8. The epoxy resin composition as claimed in claim 6, wherein the curing accelerator comprises tetrabutylphosphonium acetate.

9. The epoxy resin composition as claimed in claim 1, further comprising a silane dispersing agent.

10. The epoxy resin composition as claimed in claim 9, wherein the silane dispersing agent is present in an amount between 0 and 1 parts by weight, based on 100 parts by weight of the epoxy resin.

11. The epoxy resin composition as claimed in claim 1, further comprising a phosphorous-containing flame retardant.

12. The epoxy resin composition as claimed in claim 11, wherein the phosphorous-containing flame retardant is present in an amount between 0 and 25 parts by weight, based on 100 parts by weight of the epoxy resin.

13. The epoxy resin composition as claimed in claim 1, further comprising a toughening agent.

14. The epoxy resin composition as claimed in claim 13, wherein the toughening agent is present in an amount between 0 and 5 parts by weight, based on 100 parts by weight of the epoxy resin.

15. The epoxy resin composition as claimed in claim 13, wherein the toughening agent includes carboxyl-terminated butadiene acrylonitrile rubber.

16. The epoxy resin composition as claimed in claim 1, further comprising an inorganic filler.

17. The epoxy resin composition as claimed in claim 16, wherein the inorganic filler is present in an amount between 0 and 80 parts by weight, based on 100 parts by weight of the epoxy resin.

18. The epoxy resin composition as claimed in claim 16, wherein the inorganic filler includes talc, and aluminium hydroxide.

19. A prepreg produced by impregnating a reinforcing material with the epoxy resin composition according to claim 1 to form an impregnated substrate, and drying the impregnated substrate to a semi-cured state.

20. A printed circuit board produced by laminating a particular number of the prepregs according to claim 19 to form a prepreg laminate, placing a metal foil on at least one outermost layer of the prepreg laminate and heat pressure-molding the prepreg laminate to form a metal-clad laminate, and forming a circuit pattern on a surface of the metal foil on the metal-clad laminate.