SEMICONDUCTOR ELECTRONIC DEVICE WITH AN INTEGRATED DEVICE WITH AN INTEGRATED GALVANIC ISOLATOR ELEMENT AND RELATED ASSEMBLY PROCESS

• US 20120168901A1
• Filed: 12/28/2011
• Published: 07/05/2012
• Est. Priority Date: 12/29/2010
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Santangelo, Antonello, Smerzi, SantoAlessandro
• Granted Patent: US 8,592,944 B2
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An electronic device is provided with: a first electronic circuit, integrated in a first die; a second electronic circuit, integrated in a second die; and a galvanic isolator element, designed to insulate galvanically, and to enable transfer of signals between, the first electronic circuit and the second electronic circuit. The galvanic isolator element has: a transformer substrate, distinct from the first die and from the second die; and a galvanic-insulation transformer formed by a first inductive element, integrated in the first die, and by a second inductive element, integrated in the transformer substrate and so arranged as to be magnetically coupled to the first inductive element.

Claims

1. An electronic device, comprising:

a first electronic circuit integrated in a first die;

a second electronic circuit integrated in a second die; and

a galvanic isolator element positioned on, and entirely supported by, the first die, the galvanic isolator element being configured to insulate galvanically, and to enable transfer of signals between, said first and second electronic circuits, wherein said galvanic isolator element comprises;

a transformer substrate distinct from said first die and said second die;

a first inductive element integrated in said first die; and

a second inductive element integrated in said transformer substrate and configured to be operatively coupled to said first inductive element.

2. The device according to claim 1, wherein:

said first die comprises a structural layer of semiconductor material in which said first electronic circuit is integrated;

a dielectric layer set on said structural layer;

a top metal level arranged at a top portion of said dielectric layer, at a distance from said structural layer;

said first inductive element is positioned in the top metal layer; and

said transformer substrate is arranged on said first die so that said second inductive element vertically overlies, and is magnetically coupled to, said first inductive element, thereby forming a transformer.

3. The device according to claim 2, wherein:

said transformer substrate is made of a dielectric material;

said second inductive element is set on a top surface of said transformer substrate, opposite to a bottom surface of said transformer substrate, which is coupled to said first die; and

said galvanic insulation is provided at least through a thickness of said transformer substrate.

4. The device according to claim 2, further comprising an adhesive layer, of insulating material, attaching the first die to the transformer substrate;

wherein an overall thickness of said adhesive layer and of said transformer substrate, set between said first inductive element and said second inductive element, contributes to defining said galvanic insulation.

5. The device according to claim 1, wherein said transformer substrate is made of a dielectric material in the group consisting of:

a plastic material, a polymer, polyester, polyethylene, polyamide, Pyralux™

, a glass fiber, a resin, an epoxy resin, ceramic, and glass.

6. The device according to claim 1, wherein said first inductive element and said second inductive element include a respective coil of conductive material.

7. The device according to claim 1, further comprising:

a package;

a first leadframe on which said first die is positioned;

a second leadframe electrically insulated from the first leadframe and on which said second die is positioned, the first and second dies being set alongside one another within the package; and

first and second electrical-connection elements coupled to the first and second leadframes, respectively, and protruding from said package for electrical connection outside of said electronic device.

8. The device according to claim 1, further comprising:

first connection elements integrated in said first die and electrically coupling said first inductive element to said first electronic circuit; and

second connection elements extending between said transformer substrate and said second die and electrically coupling said second inductive element to said second electronic circuit.

9. The device according to claim 1, wherein said first electronic circuit includes a transmitter electrically coupled to said first inductive element and configured to transmit said signals;

and said second electronic circuit includes a receiver electrically coupled to said second inductive element and configured to receiving said signals from the transmitter.

10. A process for assembling an electronic device, comprising:

integrating a first electronic circuit in a first die;

integrating a second electronic circuit in a second die; and

providing a galvanic isolator element that is entirely supported by the first die, the galvanic isolator element being configured to insulate galvanically, and to enable transfer of signals between, said first and second electronic circuits,

wherein providing a galvanic isolator element comprises;

integrating a first inductive element in said first die;

integrating a second inductive element in a transformer substrate, distinct from said first die and said second die; and

arranging said second inductive element so as to be operatively coupled to said first inductive element, thereby forming said galvanic isolator element between said first electronic circuit and said second electronic circuit.

11. The process according to claim 10, wherein:

integrating said first electronic circuit comprises providing said first electronic circuit in a structural layer of semiconductor material of said first die;

integrating said first inductive element comprises defining a top metal level of said first die, set at a top portion of a dielectric layer, overlying said structural layer; and

arranging comprises, after integrating said first inductive element and said second inductive element, positioning said transformer substrate on said first die so that said second inductive element is set vertically in a position corresponding to said first inductive element, thereby forming a transformer.

12. The process according to claim 11, wherein positioning comprises attaching said transformer substrate to said first die by an adhesive layer of insulating material.

13. The process according to claim 11, wherein positioning comprises positioning said transformer substrate on said first die so as to leave exposed contact pads, provided, at least in part, in said top metal level, for electrical contact of said first electronic circuit from outside of said electronic device.

14. The process according to claim 10, further comprising:

positioning said first die and said second die alongside one another within a same package, on a first leadframe and, respectively, a second leadframe, which are electrically insulated from one another; and

connecting said first leadframe and said second leadframe to respective electrical-connection elements protruding from said package for electrical connection outside of said electronic device.