SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a substrate,an integrated circuit including a thin film transistor,an antenna having a conducting wire, andan insulating film over the conducting wire,wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, andfine particles of a soft magnetic material are included in the insulating film.
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Accused Products
Abstract
A semiconductor device such as an ID chip of the present invention includes an integrated circuit using a semiconductor element formed by using a thin semiconductor film, and an antenna connected to the integrated circuit. It is preferable that the antenna is formed integrally with the integrated circuit, since the mechanical strength of an ID chip can be enhanced. Note that the antenna used in the present invention also includes a conducting wire that is wound round circularly or spirally and fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are arranged between the conducting wires. Specifically, an insulating layer in which fine particles of a soft magnetic material are included is arranged between the conducting wires.
8 Citations
1 Claim
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1. A semiconductor device comprising:
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a substrate, an integrated circuit including a thin film transistor, an antenna having a conducting wire, and an insulating film over the conducting wire, wherein the integrated circuit and the antenna are formed over the substrate to be electrically connected to each other, and fine particles of a soft magnetic material are included in the insulating film.
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Specification