Heatsink Device and Method

• US 20120211214A1
• Filed: 12/09/2011
• Published: 08/23/2012
• Est. Priority Date: 12/09/2010
• Status: Abandoned Application

• Current Assignee: Panasonic Avionics Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Avionics Corporation (Panasonic Holdings Corporation)
• Inventors: Phan, Hien Van
• Application Number:
  US13/316,403
• Publication Number:
  US 20120211214A1
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A heatsink device and methods for manufacturing and using same. The heatsink device includes a plurality of heatsink fins that extend from a heatsink base. Each heatsink fin has a distal end region and a proximal end region disposed adjacent to the heatsink base. A fin width of each heatsink fin progressively decreases from the proximal end region to the distal end region in accordance with a parabolic profile such that opposing fin profiles of adjacent heatsink fins define an air space that is parabolic. The parabolic chamfer advantageously promotes full heat flow from the heatsink base to the heatsink fins and removes more heat than conventional heatsink devices. When applied in conjunction with a heat-generating component, the heatsink can enable the heat-generating component to operate at a lower stabilized component temperature. Accordingly, the performance, reliability, safety, and operational lifetime of the heat-generating component can be increased.

Claims

1. A heatsink device, comprising:

a heatsink base;

a first heatsink fin extending from said heatsink base, said first heatsink fin having a first sidewall; and

a second heatsink fin extending from said heatsink base, said second heatsink base having a second sidewall opposing the first sidewall of the first heatsink fin, the first sidewall and second sidewall forming a parabolic curvature,

wherein the parabolic curvature enables heat to flow at near-maximum rate from said heatsink base.

2. The heatsink device of claim 1, wherein the parabolic curvature satisfies the parabolic formula y=k*x², where k is a preselected offset relative to a fin surface from a vertex (x,y) of said parabolic curvature, wherein the coefficient k has a value within a range between 2 and 8, and wherein the parabolic curvature is sufficiently asymptotic such that the parabolic curvature can be approximated by a planar portion.

3. The heatsink device of claim 1, wherein said first heatsink fin includes a fin width, said fin width progressively decreasing from a proximal width at a proximal end region of said first heatsink fin to a distal width at a distal end region of said heatsink fin.

4. The heatsink device of claim 1, wherein said first heatsink fin and said second heatsink fin are adjacent.

5. The heatsink device of claim 1, wherein a plurality of heatsink fins extend from said heatsink base, said heatsink fins each having a proximal end region disposed adjacent to said heatsink base and a distal end region having a distal width that is less than a width of said proximal end region.

6. The heatsink device of claim 5, wherein said plurality of heatsink fins are one or more of uniform and uniformly disposed on said heatsink base.

7. The heatsink device of claim 5, wherein a spacing between adjacent heatsink fins is equal to said distal width of said heatsink fins.

8. The heatsink device of claim 5, wherein said proximal end regions of adjacent heatsink fins form a parabolic profile that permits full heat flow from said heatsink base to enter said adjacent heatsink fins.

9. The heatsink device of claim 5, wherein said proximal end regions of adjacent heatsink fins form a circular chamfer that permit full heat flow from said heatsink base to enter said adjacent heatsink fins.

10. The heatsink device of claim 1, wherein said first heatsink fin is formed on said heatsink base.

11. The heatsink device of claim 1, wherein said first heatsink fin has a fin width that progressively decreases in accordance with the parabolic chamfer.

12. The heatsink device of claim 1, wherein said heatsink base is suitable for coupling with a heat-generating system elements selected from a system element group consisting of an integrated circuit, a capacitor, a resistor, a high-speed moving mechanical part, and a rotating mechanical part.

13. The heatsink device of claim 1, further comprising a heatsink fan that forces air across said heatsink fin.

14. The heatsink device of claim 1, wherein said first heatsink fin is provided as a whole heatsink fin, wherein said first heatsink fin is provided as a fractional heatsink fin comprising a predetermined lengthwise fraction of the whole heatsink fin, wherein the predetermined fraction is selected from a range between ten percent and ninety percent of the whole heatsink fin, wherein the predetermined fraction is within a five-percent range between ten percent and ninety percent of the whole heatsink fin, and wherein said fractional heatsink fin is provided as a half heatsink fin.

15. A method for manufacturing a heatsink device, comprising:

providing a heatsink base; and

disposing a heatsink fin on said heatsink base, said heatsink fin extending from said heatsink base and having a cross-sectional shape for providing a rounded profile,

wherein a curvature of the rounded profile of said heatsink fin enables heat to flow at near-maximum rate from said heatsink base.

16. The method of claim 15, wherein said disposing said heatsink fin on said heatsink base comprises disposing a plurality of heatsink fins on said heatsink base, said heatsink fins each having a proximal end region disposed adjacent to said heatsink base and a distal end region having a width that is less than a width of said proximal end region.

17. The method of claim 16, wherein the curvature of the rounded profile satisfies a parabolic formula y=k*x², where k is a preselected coefficient and the curvature has a vertex adjacent to said proximal end region of said heatsink fin.

18. A vehicle information system suitable for installation aboard a passenger vehicle, comprising:

a line replaceable unit associated with the vehicle information system; and

a heatsink device coupled with a suitable surface of said line replaceable unit and including;

a heatsink base;

a first heatsink fin extending from said heatsink base, said first heatsink fin having a first sidewall; and

a second heatsink fin extending from said heatsink base, said second heatsink base having a second sidewall opposing the first sidewall of the first heatsink fin, the first sidewall and second sidewall forming a parabolic curvature,

wherein the parabolic curvature enables heat to flow at near-maximum rate from said heatsink base.

19. The vehicle information system of claim 18, wherein said line replaceable unit is selected from a group consisting of a media server system, a content source, a switching system, an area distribution box, a floor disconnect box, a seat electronics box, a video seat electronics box, a monitor system, and a power supply system.

20. The vehicle information system of claim 18, wherein the passenger vehicle comprises an aircraft.