LIGHT SOURCE HEAT-DISSIPATION STRUCTURE OF BACKLIGHT MODULE

• US 20120250288A1
• Filed: 11/26/2010
• Published: 10/04/2012
• Est. Priority Date: 10/08/2010
• Status: Abandoned Application

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Que, Chengwen
• Application Number:
  US13/000,989
• Publication Number:
  US 20120250288A1
• Time in Patent Office: Days
• US Class Current: 362/97.1
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133628 with cooling means

Abstract

The present invention provides a light source heat-dissipation structure of a backlight module having: a light-source structure, the heat-dissipation base and a carrier. The light-source structure has leads, respectively. The heat-dissipation base has a supporting surface, an attachment surface and first through holes. The carrier has second through holes, and the carrier is attached to the attachment surface of the heat-dissipation base. The light-source structure is set on the supporting surface of the heat-dissipation base, and the leads of the light-source structure pass through the first through holes and the second through holes and then electrically connect with the carrier. Hence, the heat-dissipation base may directly support and thermally contact the light-source structure for relatively enhancing the heat-dissipation efficiency of the light-source structure.

Claims

1. A light source heat-dissipation structure of a backlight module, characterized in that:

the light source heat-dissipation structure of the backlight module comprises;

at least one light-source structure, each of which comprises at least one light-emitting diode and at least one lead;

a heat-dissipation base having a supporting surface, an attachment surface and at least one first through hole, wherein the at least one first through hole passes through the supporting surface and the attachment surface; and

a carrier having a first surface, a second surface and at least one second through hole, wherein the at least one second through hole passes through the first surface and the second surface, and the first surface is attached to the attachment surface of the heat-dissipation base;

wherein the at least one light-emitting diode of the at least one light-source structure is mounted on the supporting surface of the heat-dissipation base, and the at least one lead passes through the at least one first through hole of the heat-dissipation base and the at least one second through hole of the carrier and electrically connects to the carrier.

2. The light source heat-dissipation structure of the backlight module according to claim 1, characterized in that:

each of the at least one first through hole of the heat-dissipation base and the at least one second through hole of the carrier is further filled with a filler, so that the at least one lead is fixed in the at least one first through hole and the at least one second through hole and is electrically isolated from the heat-dissipation base, and the heat-dissipation base is combined with the carrier.

3. The light source heat-dissipation structure of the backlight module according to claim 1, characterized in that:

the heat-dissipation efficiency of heat-dissipation base is better than the heat-dissipation efficiency of the carrier, wherein the heat-dissipation base is a metal heat-dissipation base or an alloy heat-dissipation base, and the carrier is a circuit board.

4. A light source heat-dissipation structure of a backlight module, characterized in that:

the light source heat-dissipation structure of the backlight module comprises;

at least one light-source structure, each of which comprises at least one lead;

a heat-dissipation base having a supporting surface, an attachment surface and at least one first through hole, wherein the at least one first through hole passes through the supporting surface and the attachment surface; and

a carrier having a first surface and at least one second through hole, wherein the at least one second through hole passes through the first surface and the second surface, and the first surface is attached to the attachment surface of the heat-dissipation base;

wherein the at least one light-source structure is mounted on the supporting surface of the heat-dissipation base, and the at least one lead of the at least one light-source structure passes through the at least one first through hole of the heat-dissipation base and the at least one second through hole of the carrier and electrically connects to the carrier.

5. The light source heat-dissipation structure of the backlight module according to claim 4, characterized in that:

each of the light-source structure further comprises at least one light-emitting diode.

6. The light source heat-dissipation structure of the backlight module according to claim 5, characterized in that:

the light source heat-dissipation structure is a side-light type light-emitting diode light bar or a direct type light-emitting diode light bar.

7. The light source heat-dissipation structure of the backlight module according to claim 4, characterized in that:

each of the at least one first through hole of the heat-dissipation base and the at least one second through hole of the carrier is further filled with a filler, so that the at least one lead is fixed in the at least one first through hole and the at least one second through hole, and the heat-dissipation base is combined with the carrier.

8. The light source heat-dissipation structure of the backlight module according to claim 7, characterized in that:

the filler is an insulating adhesive to electrically isolate the at least one lead from the heat-dissipation base.

9. The light source heat-dissipation structure of the backlight module according to claim 4, characterized in that:

the carrier is a printed circuit board.

10. The light source heat-dissipation structure of the backlight module according to claim 4, characterized in that:

the heat-dissipation base is a metal heat-dissipation base or an alloy heat-dissipation base.