STACKABLE ELECTRONIC COMPONENT

• US 20130081266A1
• Filed: 11/26/2012
• Published: 04/04/2013
• Est. Priority Date: 08/31/2007
• Status: Active Application

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Xing, Kun
• Application Number:
  US13/685,416
• Publication Number:
  US 20130081266A1
• Time in Patent Office: Days
• US Class Current: 29/840
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor

Abstract

An embodiment of an electronic component includes a circuit element disposed within a package, which includes a surface and at least one standoff protruding from the surface. For example, where the circuit element is an inductor in a power supply, the standoff may allow one to mount the inductor component over another component, such as a transistor component. Therefore, the layout area of such a power supply may be smaller than the layout area of a power supply in which the inductor and transistor components are mounted side by side.

Claims

1. A method, comprising:

placing a first component over a circuit board; and

placing a first portion of a second component over the first component such that a second portion of the second component contacts the circuit board, and such that the first and second portions of the second component define a space within which is located the first component.

2. The method of claim 1 wherein placing the first component comprises placing the first component in contact with the circuit board.

3. The method of claim 1, further comprising at least partially filling a space between the first component and the first portion of the second component with a thermally conductive material.

4. The method of claim 1 wherein placing the first and second components comprises soldering the first component and the second portion of the second component to the board.

5. The method of claim 1 wherein:

placing the first component comprises coupling a lead of the first component to a conductive path disposed on the circuit board; and

placing the second component comprises coupling a lead of the second component to the conductive path.