INSULATING SHEET, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING STRUCTURE USING THE INSULATING SHEET

• US 20130149514A1
• Filed: 07/26/2011
• Published: 06/13/2013
• Est. Priority Date: 07/30/2010
• Status: Abandoned Application

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Hayashi, Katsura
• Application Number:
  US13/813,368
• Publication Number:
  US 20130149514A1
• Time in Patent Office: Days
• US Class Current: 428/213
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2264/10 Inorganic particles
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 27/14 next to a particulate layer
• CPC Class Codes: H01B 3/02 mainly consisting of inorganic substances
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0175 Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 3/4602 characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4673 Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer similar methods for protective coatings H05K3/28
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/25 : Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Abstract

An insulating sheet includes a resin sheet, and an insulating layer disposed on the resin sheet, wherein the insulating layer includes an inorganic insulating layer, and the inorganic insulating layer includes first inorganic insulating particles which have a particle size of not less than 3 nm and not greater than 110 nm and which are bonded to each other.

Claims

1. An insulating sheet, comprising:

a resin sheet; and

an insulating layer disposed on the resin sheet,

wherein the insulating layer includes an inorganic insulating layer, and

the inorganic insulating layer comprises first inorganic insulating particles which have a particle size of not less than 3 nm and not greater than 110 nm and which are bonded to each other.

2. The insulating sheet according to claim 1,

wherein the resin sheet includes a thermoplastic resin.

3. The insulating sheet according to claim 1,

wherein the insulating layer further includes a first resin layer which is disposed on the inorganic insulating layer and which includes an uncured thermosetting resin.

4. The insulating sheet according to claim 1,

wherein the insulating layer further includes a second resin layer which is disposed between the resin sheet and the inorganic insulating layer.

5. The insulating sheet according to claim 4,

wherein the insulating layer further includes a first resin layer which is disposed on the inorganic insulating layer and which includes an uncured thermosetting resin, and

a thickness of the second resin layer is smaller than a thickness of the first resin layer.

6. The insulating sheet according to claim 5,

wherein the first resin layer includes a first inorganic insulating filler composed of a plurality of particles, and

the second resin layer includes a second inorganic insulating filler composed of a plurality of particles, and a particle size of the plurality of particles of the second inorganic insulating filler is smaller than a particle size of the plurality of particles of the first inorganic insulating filler.

7. The insulating sheet according to claim 1,

wherein the inorganic insulating layer further includes second inorganic insulating particles which are adhered to each other via the first inorganic insulating particles, and a particle size of the second inorganic insulating particles is not less than 0.5 μ

m and not greater than 5 μ

m.

10. A method of manufacturing a structure, comprising:

a step of laminating the insulating sheet according to claim 1 on a support member via a first resin layer including an uncured thermosetting resin so that the resin sheet becomes an outermost layer;

a step of adhering the inorganic insulating layer to the support member via the first resin layer by heating the first resin layer at a temperature of not lower than a curing start temperature of the thermosetting resin and lower than a melting point of a resin included in the resin sheet; and

a step of removing the resin sheet from the inorganic insulating layer.

11. A method of manufacturing a structure comprising:

a step of preparing the insulating sheet according to claim 1;

a step of removing the resin sheet from the insulating layer; and

a step of forming a conductive layer on a main surface of the insulating layer which main surface is disposed on a resin sheet side.

12. The method of manufacturing a structure according to claim 11,

wherein the insulating sheet further includes a second resin layer disposed between the resin sheet and the inorganic insulating layer, and

at the step of forming the conductive layer on the main surface of the insulating layer which main surface was disposed on the resin sheet side, the conductive layer on a main surface of the second resin layer which main surface is disposed on a resin sheet side is formed.

8. A method of manufacturing an insulating sheet, comprising:

a step of directly or indirectly applying inorganic insulating sol, including first inorganic insulating particles having a particle size of not less than 3 nm and not greater than 110 nm, onto a resin sheet; and

a step of bonding the first inorganic insulating particles to each other to form an inorganic insulating layer by heating the first inorganic insulating particles at a temperature of lower than a melting point of a resin included in the resin sheet.

9. The method of manufacturing an insulating sheet according to claim 8, further comprising:

a step of forming a resin layer on the resin sheet before applying the inorganic insulating sol,

wherein the resin layer is disposed between the inorganic insulating layer and the resin sheet.