CONNECTION BRIDGES FOR DUAL INTERFACE TRANSPONDER CHIP MODULES

• US 20150129665A1
• Filed: 10/27/2014
• Published: 05/14/2015
• Est. Priority Date: 11/13/2013
• Status: Abandoned Application

• Current Assignee: AmaTech Group Limited (Paragon Group Limited)
• Original Assignee: AmaTech Group Limited (Paragon Group Limited)
• Inventors: Finn, David, Lotya, Mustafa
• Application Number:
  US14/523,993
• Publication Number:
  US 20150129665A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: B23K 2101/32 Wires
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/21 by welding
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

Connection bridges (CBR) for dual-interface transponder chip modules (TCM) 200 may have an area which is substantially equal to or greater than an area of a contact pad (CP) of a contact pad array (CPA). A given connection bridge may be L-shaped and may comprise (i) a first portion disposed external to the contact pad array and extending parallel to the insertion direction, and (ii) a second portion extending from an end of the first portion perpendicular to the insertion direction to within the contact pad array (CPA) such as between C1 and C5. The connection bridge may extend around a corner of the contact pad array, may be large enough to accommodate wire bonding, and may be integral with a coupling frame (CF) extending around the contact pad array. The transponder chip modules may be integrated into a smart card (SC).

Claims

1. Transponder chip module (TCM) comprising:

a substrate (MT, CCT) having two surfaces;

contact pads (CP) disposed in a contact pad array (CPA) on a first surface of the substrate; and

a connection bridge (CBR) disposed on the first surface of the substrate for interconnecting components on a second surface of the substrate;

wherein an insertion direction is defined for the transponder chip module;

characterized by;

the connection bridge has an area which is at least 25% of, including substantially equal to or greater than an area of a contact pad in the contact pad array.

2. The transponder chip module (TCM) of claim 1, wherein the components comprise:

a module antenna (MA); and

an RFID chip (CM, IC).

3. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge is L-shaped and comprises;

a first portion of the connection bridge is external to the contact pad array and extends parallel to the insertion direction; and

a second portion of the connection bridge extends perpendicular to the insertion direction to within the contact pad array.

4. The transponder chip module (TCM) of claim 1, wherein:

at least a portion of the connection bridge has an area large enough to support wire bonding.

5. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge can effect interconnections without requiring plated-through holes.

6. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge is large enough to support a logo.

7. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge extends around a corner of the contact pad array.

8. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge is disposed entirely external to the contact pad array.

9. The transponder chip module (TCM) of claim 1, wherein:

the connection bridge is disposed entirely internal to the contact pad array.

10. The transponder chip module (TCM) of claim 1, further comprising:

a second connection bridge disposed on the first surface of the substrate.

11. The transponder chip module (TCM) of claim 10, wherein:

both connection bridges extend parallel to the insertion direction.

12. The transponder chip module (TCM) of claim 1, further comprising:

an open-loop coupling frame (CF) extending around the contact pad array.

13. The transponder chip module (TCM) of claim 1, wherein:

the coupling frame is integral with the connection bridge.

14. A smart card comprising the transponder chip module (TCM) of claim 1.

15. Transponder chip module (TCM) comprising:

a substrate (MT, CCT) having two surfaces;

contact pads (CP) disposed in a contact pad array (CPA) on a first surface of the substrate;

a connection bridge (CBR) disposed on the first surface of the substrate for interconnecting components on a second surface of the substrate;

wherein an insertion direction is defined for the transponder chip module;

characterized by;

a first portion of the connection bridge is external to the contact pad array, and extends parallel to the insertion direction; and

a second portion of the connection bridge extends perpendicular to the insertion direction to within the contact pad array.