Optoelectronic Semiconductor Component and Method for Producing Said Component
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Abstract
An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.
4 Citations
31 Claims
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1-15. -15. (canceled)
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16. An optoelectronic semiconductor component comprising:
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a carrier comprising at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view; electrical contact structures fitted at least indirectly to the carrier; and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A method for producing an optoelectronic semiconductor component, the method comprising:
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(1) providing a carrier by forming a potting body around a conversion-medium body; (2) fitting individual semiconductor chips to the conversion-medium body; (3) forming a filling around the individual semiconductor chips; and (4) forming a heat sink by depositing a material at a side of the individual semiconductor chips and of the filling which faces away from the carrier, wherein the steps are performed in the stated order.
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31. An optoelectronic semiconductor component comprising:
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a carrier comprising at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view; electrical contact structures fitted at least indirectly to the carrier; and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the plurality of optoelectronic semiconductor chips configured to generate radiation, wherein the potting body comprises a plastic, a silicone or a resin, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structures, and wherein the contact structure comprise conductor tracks, wherein the conductor tracks are designed for energizing the optoelectronic semiconductor chips, and wherein the conductor tracks are situated in a plane between the carrier and the semiconductor chips.
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Specification