Optoelectronic semiconductor component and method for producing said component

• US 9,583,467 B2
• Filed: 09/06/2013
• Issued: 02/28/2017
• Est. Priority Date: 09/25/2012
• Status: Expired due to Fees

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Illek, Stefan, Schwarz, Thomas, Moosburger, Jrgen, Wegleiter, Walter
• Primary Examiner(s): GHYKA, ALEXANDER G
• Application Number:
  US14/430,215
• Publication Number:
  US 20150249070A1
• Time in Patent Office: 1,271 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component includes a carrier including at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places, as seen in plan view, electrical contact structures fitted at least indirectly to the carrier and a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the optoelectronic semiconductor chips configured to generate radiation, wherein the conversion-medium body is shaped as a plate, wherein the semiconductor chips are directly mechanically connected to the conversion-medium body, and wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structure.

Claims

1. An optoelectronic semiconductor component comprising:

a carrier comprising at least one conversion-medium body and a potting body, the potting body surrounding the conversion-medium body at least in places;

electrical contact structures fitted at least indirectly to the carrier;

a plurality of optoelectronic semiconductor chips fitted to a main face of the carrier, the plurality of optoelectronic semiconductor chips configured to generate radiation; and

a filling fitted around the semiconductor chips,

wherein the conversion-medium body is shaped as a plate,

wherein the semiconductor chips are directly mechanically connected to the conversion-medium body,

wherein the filling terminates flush with the semiconductor chips, in a direction away from the conversion-medium body,

wherein the conversion-medium body is free of cutouts for the electrical contact structures and is not penetrated by the electrical contact structures,

wherein the electrical contact structures comprise conductor tracks, wherein the conductor tracks are designed for energizing the semiconductor chips, and wherein the conductor tracks are situated in a plane between the carrier and the semiconductor chips.

2. The optoelectronic semiconductor component according to claim 1, wherein an average distance between adjacent semiconductor chips is at most 200 μ

m, and wherein the conversion-medium body extends continuously over the plurality of optoelectronic semiconductor chips and projects laterally beyond the semiconductor chips.

3. The optoelectronic semiconductor component according to claim 1, wherein electrical contact locations of the semiconductor chips face the carrier.

4. The optoelectronic semiconductor component according to claim 1, wherein electrical contact locations of the semiconductor chips face away from the carrier, and wherein electrical contact locations of the semiconductor chips and the conductor tracks are spaced apart from the conversion-medium body.

5. The optoelectronic semiconductor component according to claim 1, wherein a mirror is situated at least in places between the electrical contact structures and the conversion-medium body.

6. The optoelectronic semiconductor component according to claim 1, wherein the semiconductor chips are arranged in a matrix-like fashion within at least one array and the conversion-medium body extends over the entire array, wherein in regions alongside the array the potting body has a greater thickness than at the conversion-medium body, and wherein a thickness of the conversion-medium body is constant.

7. The optoelectronic semiconductor component according to claim 6, wherein the potting body, in the region alongside the array, is penetrated by at least two electrical plated-through holes, wherein the optoelectronic semiconductor component is designed to be electrically connected at a radiation main side of the carrier facing away from the semiconductor chips.

8. The optoelectronic semiconductor component according to claim 1, wherein a heat sink is fitted to a side of the semiconductor chips which faces away from the carrier.

9. The optoelectronic semiconductor component according to claim 8, wherein the heat sink extends in a positively locking manner and continuously over all of the semiconductor chips.

10. The optoelectronic semiconductor component according to claim 8, wherein the heat sink is segmented, wherein segments of the heat sink are assigned to one or a plurality of the semiconductor chips.

11. The optoelectronic semiconductor component according to claim 1, wherein the conversion-medium body comprises a plurality of the conversion-medium bodies, wherein the conversion-medium bodies are mechanically permanently and fixedly connected to one another via the potting body.

12. The optoelectronic semiconductor component according to claim 1, wherein the conversion-medium body is a ceramic.