INTEGRATED PASSIVE MODULE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

  • US 20160150649A1
  • Filed: 11/25/2015
  • Published: 05/26/2016
  • Est. Priority Date: 11/25/2014
  • Status: Abandoned Application
First Claim
Patent Images

1. An integrated passive module, comprising:

  • a ceramic substrate in which at least one first passive component is embedded;

    a planar layer disposed on the ceramic substrate; and

    a thin film laminate comprising at least one second passive component and disposed on the planar layer, wherein the thin film laminate is electrically connected to the first passive component.

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