ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND PHYSICAL-QUANTITY SENSOR

• US 20170199217A1
• Filed: 12/29/2016
• Published: 07/13/2017
• Est. Priority Date: 01/13/2016
• Status: Active Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: NARUSE, Atsuki, KIGURE, Shota
• Application Number:
  US15/393,457
• Publication Number:
  US 20170199217A1
• Time in Patent Office: Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: B81B 7/04 Networks or arrays of similar microstructural devices
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0172 Seals
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An electronic device includes a package; and a functional element, in which a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.

Claims

1. An electronic device comprising:

a package; and

a functional element,

wherein a side surface of the functional element is fixed to a side wall of the package on an inner side thereof via an adhesive.

2. The electronic device according to claim 1,

wherein the functional element is fixed to the side wall to which one side surface of the functional element is fixed.

3. The electronic device according to claim 2,

wherein the functional element is fixed to the side wall to which a part of the one side surface of the functional element is fixed.

4. The electronic device according to claim 1,

wherein the functional element abuts on an inner bottom surface of the package.

5. The electronic device according to claim 4,

wherein the package is formed of a material containing a ceramic.

6. The electronic device according to claim 5,

wherein the functional element has a substrate and the substrate is formed of a material containing borosilicate glass.

7. The electronic device according to claim 6,

wherein a base compound of the adhesive is formed of a resin-based material.

8. The electronic device according to claim 6,

wherein a base compound of the adhesive is formed of an inorganic material.

13. An electronic device comprising the electronic device according to claim 1.

14. A moving object comprising the electronic device according to claim 1.

9. A method for manufacturing an electronic device comprising:

applying an adhesive on a side surface of a functional element;

fixing the side surface of the functional element to a side surface of a package on an inner side thereof;

curing the adhesive;

fixing an IC to the functional element;

electrically connecting the functional element and the IC;

electrically connecting the package and the IC; and

mounting and sealing a lid member on the package.

10. A physical-quantity sensor comprising:

a first substrate;

a second substrate fixed on the first substrate via the adhesive; and

a sensor element disposed on the second substrate,

wherein the sensor element is provided with a fixed electrode portion fixed to the second substrate, and a support that fixes a movable electrode portion to be movable and is fixed to the second substrate, and

wherein the adhesive is disposed on one side of an outer peripheral portion of the second substrate so as not to overlap the fixed electrode portion and the support when the second substrate is viewed in a plan view.

11. The physical-quantity sensor according to claim 10,

wherein the one side of the second substrate is provided with a terminal unit that is connected to the outside, and

wherein the terminal unit is disposed to overlap the adhesive when the second substrate is viewed in the plan view.

12. The physical-quantity sensor according to claim 11,

wherein the sensor element is configured to have a first sensor element having a detecting direction in a first direction along a main surface of the second substrate, a second sensor element having a detecting direction in a second direction intersecting with the first direction along the main surface of the second substrate, and a third sensor element having a detecting direction in a third direction intersecting with the first direction and the second direction, and

wherein the third sensor element is disposed in a region farther separated from the one side than the first sensor element and the second sensor element.

15. An electronic device comprising the physical quantity sensor according to claim 10.

16. A moving object comprising the physical quantity sensor according to claim 10.