LOW DIELECTRIC CONSTANT (DK) AND DISSIPATION FACTOR (DF) MATERIAL FOR NANO-MOLDING TECHNOLOGY (NMT)
First Claim
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1. A thermoplastic composition comprising:
- from 15 wt. % to 80 wt. % of a polymer resin; and
from 10 wt. % to 50 wt. % of a low dielectric constant glass fiber component, wherein the glass fiber component has a Dk of less than 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than 0.002 at a frequency of from 1 MHz to 1 GHz;
from 3 wt. % to 40 wt. % of a hollow filler; and
from 0.1 wt. % to 10 wt. % of an impact modifier,wherein the thermoplastic composition exhibits a dielectric constant of less than 3.2 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness;
wherein the thermoplastic composition exhibits a dissipation factor Df of less than 0.01 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness,wherein the thermoplastic composition exhibits a nano-molding technology bonding strength of at least 18 MPa when tested in accordance with a bonding strength test adapted from ISO 19095 with a T treatment,wherein the thermoplastic composition exhibits a notched impact strength of at least 70 Jim when tested in accordance with ASTM D256 at 23°
C.,wherein the thermoplastic composition exhibits a flow rate of less than 25 cm3/10 min when tested in accordance with ISO 1133 at 275°
C. at 5 kg and 300 seconds, andwherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.
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Abstract
The disclosure concerns thermoplastic resin compositions including a polymer resin, a dielectric glass fiber component, a hollow glass fiber, and an impact modifier.
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20 Claims
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1. A thermoplastic composition comprising:
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from 15 wt. % to 80 wt. % of a polymer resin; and from 10 wt. % to 50 wt. % of a low dielectric constant glass fiber component, wherein the glass fiber component has a Dk of less than 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than 0.002 at a frequency of from 1 MHz to 1 GHz; from 3 wt. % to 40 wt. % of a hollow filler; and from 0.1 wt. % to 10 wt. % of an impact modifier, wherein the thermoplastic composition exhibits a dielectric constant of less than 3.2 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness; wherein the thermoplastic composition exhibits a dissipation factor Df of less than 0.01 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness, wherein the thermoplastic composition exhibits a nano-molding technology bonding strength of at least 18 MPa when tested in accordance with a bonding strength test adapted from ISO 19095 with a T treatment, wherein the thermoplastic composition exhibits a notched impact strength of at least 70 Jim when tested in accordance with ASTM D256 at 23°
C.,wherein the thermoplastic composition exhibits a flow rate of less than 25 cm3/10 min when tested in accordance with ISO 1133 at 275°
C. at 5 kg and 300 seconds, andwherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition. - View Dependent Claims (2, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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3. A thermoplastic composition comprising:
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from 15 wt. % to 80 wt. % of a polyalkylene terephthalate resin; and from 10 wt. % to 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component; from 3 wt. % to 40 wt. % of a hollow filler; and from 0.1 wt. % to 10 wt. % of an impact modifier, wherein the low Dk/low Df glass fiber component has a Dk of less than 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than 0.002 at a frequency of from 1 MHz to 1 GHz, wherein the thermoplastic composition exhibits a dielectric constant of less than 3.2 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness; wherein the thermoplastic composition exhibits a dissipation factor Df of less than 0.01 at a frequency of 1.9 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 100 mm by 70 mm and 1.6 mm thickness and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition. - View Dependent Claims (7, 8, 9)
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19. A method for making a thermoplastic article, comprising:
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a) mixing, in any order; i. from 15 wt. % to 80 wt. % of a polyalkylene terephthalate resin; and ii. from 10 wt. % to 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component; iii. from 3 wt. % to 40 wt. % of a hollow filler; and iv. from 0.1 wt. % to 10 wt. % of an impact modifier so as to form a blend; and b) injection molding, extruding, rotational molding, blow molding, or thermoforming the blend to form the thermoplastic article. - View Dependent Claims (20)
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Specification