Pressure sensor having semiconductor sensor chip

  • US 6,694,818 B2
  • Filed: 07/16/2001
  • Issued: 02/24/2004
  • Est. Priority Date: 08/25/2000
  • Status: Expired due to Fees
First Claim
Patent Images

1. A pressure sensor comprising:

  • a cylindrical sensor case having a depressed portion formed at one longitudinal end, the depressed portion communicating wit a first pressure source through a through-hole formed in the sensor case;

    a sensor chip having a front surface and a rear surface, the sensor chip being mounted in the depressed portion so that the rear surface receives the first pressure supplied from the first pressure source;

    oil disposed in the depressed portion to cover the front surface of the sensor chip;

    a plurality of terminals disposed around the depressed portion for electrically connecting the sensor chip to an outside circuit;

    means for supplying a second pressure from a second pressure source to the oil covering the front surface of the sensor chip, the second pressure being imposed on the front surface of the sensor chip through the oil so that the sensor chip detects a pressure difference between the first and the second pressures;

    a sealing material composed of resin charged in the depressed portion to prevent the first pressure from communicating with the second pressure; and

    a plurality of charging holes for charging the sealing material into the depressed portion, each charging hole being formed between the neighboring two terminals.

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