Electric power semiconductor device

• US 7,291,928 B2
• Filed: 08/27/2003
• Issued: 11/06/2007
• Est. Priority Date: 08/30/2002
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Yamada, Junji, Saiki, Seiji
• Primary Examiner(s): Wilczewski; Mary
• Assistant Examiner(s): Tran; Thanh Y.
• Application Number:
  US10/648,347
• Publication Number:
  US 20040041253A1
• Time in Patent Office: 1,532 Days
• Field of Search: 257/666, 257/670, 257672-673, 257/676, 257/784, 257/786, 257/781, 257/779, 257690-696
• US Class Current: 257/784
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

Semiconductor chips are connected to electrode terminals (6a, 6b) by wire bonding, and connecting conductors connect extending portions (60b, 60c) extending from a part of the electrode terminals (6b, 6c) to the circuit patterns (3a, 3b) by soldering, and thus the wire bonding points of the electrode terminals are reduced to thereby reduce an electric resistance and suppress heat generation and voltage drop.

Claims

1. An electric power semiconductor device comprising:

a circuit pattern formed on a main surface of an insulating substrate;

a semiconductor chip mounted on the circuit pattern;

an electrode plate assembly formed near the circuit pattern, having a first electrode terminal provided at a predetermined position thereof and a second electrode terminal disposed below the first electrode terminal;

a first connecting conductor made by wire bonding for connecting the semiconductor chip to the first electrode terminal; and

a second connecting conductor having an extending portion extended from a part of the second electrode terminal to be connected to the circuit pattern,

wherein the second connecting conductor is provided below the first connecting conductor with a space therefrom, and the connection between the extending portion of the second electrode terminal and the circuit pattern is implemented by a solder.

2. The electric power semiconductor device according to claim 1, wherein the extending portion of the second electrode terminal has a horizontally extending portion and a bending portion downwardly bending in the vertical direction toward the circuit pattern, and an end of the bending portion is connected to the circuit pattern through soldering.

3. The electric power semiconductor device according to claim 1, wherein the extending portion of the second electrode terminal is comprised of only a linear extending portion extending in a horizontal direction having the same thickness as that of the second electrode terminal, and a predetermined position of a back surface thereof is connected to the circuit pattern through soldering.