Chuck with integrated wafer support

• US 7,362,115 B2
• Filed: 01/19/2007
• Issued: 04/22/2008
• Est. Priority Date: 12/24/2003
• Status: Expired due to Fees

• Current Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Dunklee, John, Andrews, Peter, Froemke, Brad
• Primary Examiner(s): HOLLINGTON, JERMELE M
• Application Number:
  US11/655,605
• Publication Number:
  US 20070115013A1
• Time in Patent Office: 459 Days
• Field of Search: None
• US Class Current: 324/750.03
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392

Abstract

An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.

Claims

1. A probe station comprising:

(a) a chamber that at least partially encloses a chuck assembly therein;

(b) said chuck assembly having an upper surface thereon suitable to support a wafer thereon;

(c) a plurality of members located within a periphery of said chuck assembly suitable to support said wafer;

(d) said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

(e) said chuck assembly movable from a location completely within said chamber to a location at least partially outside said chamber, a range of vertical movement of at least one of said members relative to said upper surface variable as a consequence of said position of said chuck relative to said chamber.

2. The probe station of claim 1 wherein said chamber is substantially airtight.

3. The probe station of claim 1 wherein said chuck includes a thermal unit to raise the temperature of said upper surface above ambient temperature.

4. The probe station of claim 1 wherein said chuck includes a thermal unit to lower the temperature of said upper surface below ambient temperature.

5. The probe station of claim 1 wherein said upper surface is substantially flat.

6. The probe station of claim 1 wherein said plurality of members are substantially evenly spaced around said chuck.

7. The probe station of claim 1 wherein said plurality of members are selectively raised or lowered.

8. The probe station of claim 1 wherein said plurality of members are capable of being maintained at different elevations above said upper surface.

9. The probe station of claim 1 wherein said plurality of members are movable in response to movement of a handle by a user.

10. A chuck assembly comprising:

(a) said chuck assembly having an upper surface thereon suitable to support a wafer thereon;

(b) a plurality of members located within the periphery of said chuck assembly suitable to support said wafer;

(c) said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

(d) said chuck assembly inhibited from lateral movement as a consequence of full extension of said plurality of members.

11. The chuck of claim 10 wherein said lateral movement is not inhibited when said plurality of members are fully retracted.

12. The chuck of claim 10 wherein said lateral movement is not inhibited when said plurality of members are not fully extended.

13. The chuck of claim 10 wherein vacuum is supplied to said upper surface of said chuck while said members are being retracted.

14. The chuck of claim 10 wherein vacuum is supplied to said upper surface of said chuck while said members are free from being extended above the upper surface of said chuck and said vacuum is reduced prior to extending said members above said upper surface of said chuck as a result of lifting said lift pins.

15. A chuck assembly comprising:

(a) said chuck assembly having an upper surface thereon suitable to support a wafer thereon;

(b) a plurality of members located within the periphery of said chuck assembly suitable to support said wafer;

(c) said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

(d) increasing a vacuum provided to said upper surface as a result of decreasing the extension of said plurality of members, where said plurality of members are not substantially even with said upper surface.

16. The chuck assembly of claim 15 wherein said decreasing said extension is from a point of full extension of said plurality of members to a point intermediate to said plurality of members being substantially even with said upper surface.

17. The chuck assembly of claim 15 wherein no vacuum is provided when said plurality of members are at said full extension.

18. A chuck assembly comprising:

(a) said chuck assembly having an upper surface thereon suitable to support a wafer thereon;

(b) a plurality of members located within the periphery of said chuck assembly suitable to support said wafer;

(c) said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

(d) said chuck assembly inhibited from lateral movement as a consequence of displacement of said plurality of members to a first height above said upper surface and freed from being inhibited as a consequence of displacement of said plurality of members to a second height above said upper surface, wherein said first height is greater than said second height.

19. A chuck assembly comprising:

(a) said chuck assembly having an upper surface thereon suitable to support a wafer thereon;

(b) a plurality of members located within the periphery of said chuck assembly suitable to support said wafer;

(c) said members moveable with respect to said upper surface so as to be capable of relative vertical movement with respect to said upper surface;

(d) said chuck assembly inhibited from relative movement of said members to a position above said upper surface when said chuck assembly is in a position suitable for probing said wafer.