System and method for photolithography in semiconductor manufacturing

  • US 7,501,227 B2
  • Filed: 08/31/2005
  • Issued: 03/10/2009
  • Est. Priority Date: 08/31/2005
  • Status: Active Grant
First Claim
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1. A method for producing a pattern on a substrate layer, the method comprising:

  • providing a pattern including a main feature and a dummy feature;

    providing at least one first exposure onto the layer by a higher-precision lithography mechanism, wherein the first exposure produces the pattern on the layer; and

    providing at least one second exposure onto the layer by a lower-precision lithography mechanism, wherein the second exposure removes the dummy feature from the pattern;

    thereby producing the main feature on the layer.

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