Surface position measuring method and surface position measuring device

• US 7,617,720 B2
• Filed: 12/22/2005
• Issued: 11/17/2009
• Est. Priority Date: 01/06/2005
• Status: Expired due to Fees

• Current Assignee: National University Corporation Hokkaido University
• Original Assignee: National University Corporation Hokkaido University
• Inventors: Tanaka, Masaru, Tokumoto, Hiroshi, Okajima, Takaharu
• Primary Examiner(s): Williams; Hezron
• Assistant Examiner(s): Frank; Rodney T
• Application Number:
  US11/794,761
• Publication Number:
  US 20080092640A1
• Time in Patent Office: 1,426 Days
• Field of Search: 731/05, 738/626.34, 850/38
• US Class Current: 73/105
• CPC Class Codes: B82Y 35/00 Methods or apparatus for measurement or analysis of nanostructures
• CPC Class Codes: G01Q 30/04 Display or data processing devices
• CPC Class Codes: G01Q 60/32 AC mode

Abstract

A surface position measuring method capable of measuring a position on a soft surface accurately and rapidly (real time), with low invasiveness. The method comprises the steps of measuring the spectrum of thermal oscillation of a cantilever with the distance between a cantilever tip and a sample surface being changed, extracting a fundamental mode component (spectrum area) from the obtained spectrum of thermal oscillation, and measuring a change in the spectrum area of thermal oscillation (spectrum area) with respect to the distance. A position at which the area of the cantilever thermal oscillation spectrum begins to change is evaluated as a position on the sample surface.

Claims

1. A surface position measuring method comprising:

a detection step of detecting an area of a spectrum of unforced thermal oscillation of a cantilever having a probe; and

an evaluation step of evaluating a position of a sample surface from a contact position between the probe and the sample surface measured based on change of the detected area of the spectrum of unforced thermal oscillation of the cantilever.

2. The surface position measuring method according to claim 1, wherein the evaluation step measures a position at which the detected area of the spectrum of unforced thermal oscillation of the cantilever starts to change responsive to the contact position between the probe and the sample surface.

3. The surface position measuring method according to claim 2, wherein:

the detection step comprises;

a step of detecting a displacement signal of the cantilever having the probe;

a step of performing FFT processing of the detected displacement signal to acquire the spectrum of unforced thermal oscillation; and

a step of extracting a cantilever resonance mode part from the acquired spectrum of unforced thermal oscillation and calculating an area of the spectrum of unforced thermal oscillation around a resonance frequency of the cantilever, and

the evaluation step measures a position at which the detected area of the spectrum of unforced thermal oscillation of the cantilever starts to change responsive to the contact position between the probe and the sample surface.

4. The surface position measuring method according to claim 1, further comprising rapidly measuring the spectrum of thermal oscillation while changing the distance between a tip and a sample surface, thereby extracting a fundamental mode component from the area of the spectrum of thermal oscillation, and determining the contact position by measuring spectrum area change with respect to the distance in real time, thereby permitting determining the contact position without use of forced oscillation.

5. A surface position measuring apparatus comprising:

a detection section that detects an area of a spectrum of unforced thermal oscillation of a cantilever having a probe; and

an evaluation section that evaluates a position of a sample surface from a contact position between the probe and the sample surface measured based on change of the area of the spectrum of unforced thermal oscillation of the cantilever detected by the detection section.

6. The surface position measuring apparatus according to claim 5, further comprising the apparatus rapidly measuring the spectrum of thermal oscillation while changing the distance between a tip and a sample surface, thereby extracting a fundamental mode component from the area of the spectrum of thermal oscillation, and determining the contact position by measuring spectrum area change with respect to the distance in real time, thereby permitting determining the contact position without use of forced oscillation.