Packaging a MEMS device using a frame

• US 7,715,080 B2
• Filed: 04/13/2007
• Issued: 05/11/2010
• Est. Priority Date: 04/13/2006
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Palmateer, Lauren, Natarajan, Bangalore R.
• Primary Examiner(s): Schwartz; Jordan M.
• Assistant Examiner(s): JONES, JAMES
• Application Number:
  US11/735,362
• Publication Number:
  US 20070242345A1
• Time in Patent Office: 1,124 Days
• Field of Search: 359/245, 359/290
• US Class Current: 359/245
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00285 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/032 Gluing
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 27/0006 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation G02B1/18 takes precedence; cleaning in general B08B

Abstract

A package structure and method of packaging for a MEMS device is described. A transparent substrate having an interferometric modulator array formed thereon is shown. A single or dual-layered backplate is joined to a frame that circumscribes the modulator array. The frame is bonded to the transparent substrate and to the backplate to provide a hermetic package.

Claims

1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:

providing a transparent substrate comprising at least one MEMS device formed thereon;

providing a backplate;

providing a plurality of seal pieces configured to fit together to form a frame that circumscribes the MEMS device, wherein the frame has a first bonding surface and a second bonding surface and wherein the frame comprises at least one corner comprising a crevice that provides an air permeable passageway between the seal pieces and allows gas to exit the MEMS device prior to packaging and sealing; and

forming a MEMS package wherein the transparent substrate is joined to the first bonding surface of the frame with a bonding material disposed between the first bonding surface and the substrate, and the second bonding surface of the frame is joined to the backplate.

2. The method of claim 1, wherein the seal pieces comprise substantially the same material as the transparent substrate.

3. The method of claim 1, wherein the seal pieces comprise glass.

4. The method of claim 1, wherein the seal pieces substantially surround the MEMS device.

5. The method of claim 1, wherein the backplate comprises a desiccant.

6. The method of claim 1, wherein the MEMS package comprises one or more air permeable passageways from the array to the ambient environment.

7. The method of claim 6, wherein the air permeable passageways are formed at one or more junctions of the seal pieces.

8. The method of claim 6, further comprising sealing the one or more air permeable passageways.

9. A device made by the method of claim 1.

28. The method of claim 1, wherein one or more of the seal pieces comprises a desiccant.

29. The method of claim 1, wherein the seal pieces are glass seal pieces that form said frame.

10. A microelectromechanical systems (MEMS) based device, comprising:

a transparent substrate comprising at least one MEMS device formed thereon;

a frame circumscribing the MEMS device, wherein the frame comprises a first and a second bonding surface;

one or more air permeable passageways formed at one or more corners of the frame, the one or more passageways configured to allow gas to exit the MEMS device prior to packaging and sealing;

a seal comprising a bonding material disposed between and joining the first bonding surface and the substrate; and

a backplate sealed to the second bonding surface and forming a MEMS device package.

11. The device of claim 10, wherein the frame comprises a plurality of seal pieces.

12. The device of claim 11, additionally comprising one or more air permeable passageways formed at one or more junctions of the seal pieces.

13. The device of claim 12, wherein said air permeable passageways are sealed to prevent air flow through said passageways.

14. The device of claim 10, wherein the frame comprises substantially the same material as the transparent substrate.

15. The device of claim 10, wherein the frame comprises glass.

16. The device of claim 10, wherein the frame is sealed to the transparent substrate via an epoxy ring.

17. The device of claim 10, wherein the backplate comprises a desiccant.

18. The device of claim 10, wherein said at least one MEMS device comprises an interferometric modulator.

19. The device of claim 10, further comprising:

a processor that is in electrical communication with said microelectromechanical system device, said processor being configured to process image data; and

a memory device in electrical communication with said processor.

20. The device of claim 19, further comprising a driver circuit configured to send at least one signal to said microelectromechanical system device.

21. The device of claim 20, further comprising a controller configured to send at least a portion of said image data to said driver circuit.

22. The device of claim 19, further comprising an image source module configured to send said image data to said processor.

23. The device of claim 22, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

24. The device of claim 19, further comprising an input device configured to receive input data and to communicate said input data to said processor.

30. The method of claim 10, wherein the seal pieces comprise four glass seal pieces that form said frame.

25. A microelectromechanical (MEMS) device, comprising:

means for supporting a MEMS, having a MEMS device formed thereon;

means for enclosing a MEMS package;

a glass frame that substantially circumscribes the MEMS device and comprises a sealed crevice in at least one corner, wherein the sealed crevice is configured to allow gas to exit the MEMS device prior to packaging and sealing; and

means for bonding the frame to the supporting means.

26. The device of claim 25, wherein the enclosing means comprises a backplate.

27. The device of claim 25, wherein the MEMS device comprises an interferometric modulator.

31. The device of claim 25, wherein the supporting means comprises a transparent substrate.

32. The device of claim 25, wherein the frame comprises a plurality of seal pieces.

33. The device of claim 32, wherein the seal pieces are solid glass seal pieces that form the frame.

34. The device of claim 32, wherein the seal pieces comprise four glass seal pieces that form the frame.

35. The device of claim 25, wherein the frame has a first bonding surface and a second bonding surface, and wherein the bonding means comprises a bonding material disposed between the first bonding surface of the frame and the supporting means.

36. The device of claim 35, wherein the second bonding surface of the frame is configured to be joined to the enclosing means.