Adducts and curable compositions using same

• US 7,759,435 B2
• Filed: 09/26/2006
• Issued: 07/20/2010
• Est. Priority Date: 09/26/2006
• Status: Expired due to Fees

• Current Assignee: Henkel KGaA (Henkel AG & Co KGaA)
• Original Assignee: Henkel AG & Co KGaA, Loctite (R&D) Limited
• Inventors: Burns, Barry N., McArdle, Ciaran B., Schoenfeld, Rainer, Fitzpatrick, Martin J., Wigham, Jonathan P., Tully, Ray P., Loane, Mark
• Primary Examiner(s): Zimmer; Marc S
• Application Number:
  US11/535,270
• Publication Number:
  US 20080076886A1
• Time in Patent Office: 1,393 Days
• Field of Search: None
• US Class Current: 525/476
• CPC Class Codes: C08G 18/3206 aliphatic
• CPC Class Codes: C08G 18/48 Polyethers
• CPC Class Codes: C08G 18/4825 Polyethers containing two hydroxy groups C08G18/4833 - C08G18/5096 take precedence
• CPC Class Codes: C08G 18/61 Polysiloxanes
• CPC Class Codes: C08G 18/675 Low-molecular-weight compounds
• CPC Class Codes: C08G 59/5006 aliphatic
• CPC Class Codes: C08G 59/504 containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
• CPC Class Codes: C08L 2666/08 Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers

Abstract

The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.

Claims

1. An adduct represented by the structure:

3. A curable composition comprising:

a. a thermosetting component; and

b. an adduct according to claim 1.

4. The composition of claim 3, wherein the thermosetting component is a member selected from the group consisting of epoxies, episulfides, benzozaxines and combinations thereof.

5. The composition of claim 3, wherein the thermosetting component is a member selected from the group consisting of

6. The composition of claim 3, further comprising a toughener.

2. An adduct represented by the structure:

7. A curable composition comprising:

a. a thermosetting component; and

b. an adduct according to claim 2.

8. The composition of claim 7, wherein the thermosetting component is a member selected from the group consisting of epoxies, episulfides, benzozaxines and combinations thereof.