Method for low temperature bonding and bonded structure

  • US 7,807,549 B2
  • Filed: 10/31/2007
  • Issued: 10/05/2010
  • Est. Priority Date: 02/16/2000
  • Status: Expired due to Term
First Claim
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1. A bonding method, comprising:

  • bonding first and second materials;

    removing a substantial portion of said first material to leave a remaining portion;

    forming a first bonding surface on said remaining portion;

    forming a second bonding surface on a third material, at least one of said first and second surfaces comprising an insulating material;

    enhancing activation of one of said first and second bonding surfaces;

    terminating one of said first and second bonding surfaces with species allowing formation of chemical bonds;

    bringing together said first and second bonding surfaces; and

    forming a chemical bond between said remaining portion and said third material.

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