Heat dissipation device

• US 8,047,266 B2
• Filed: 06/13/2008
• Issued: 11/01/2011
• Est. Priority Date: 06/13/2008
• Status: Expired due to Fees

• Current Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Original Assignee: Foxconn Technology Co., Ltd., Fuzhun Precision Industry Company Limited (Foxconn Technology Co., Ltd.)
• Inventors: Gong, Wei-Ping, Cao, Jun, Zhou, Shi-Wen
• Primary Examiner(s): Duong; Tho V
• Application Number:
  US12/138,439
• Publication Number:
  US 20090310304A1
• Time in Patent Office: 1,236 Days
• Field of Search: 165/80.3, 165/185, 165/104.21, 165/104.33, 361/697, 361/700, 361/704, 257/715, 174/15.2, 174/16.3
• US Class Current: 165/80.3
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.

Claims

1. A heat dissipation device, comprising:

a first heat sink;

a second heat sink located on the first heat sink; and

a heat conducting member formed by bending a flat, plate-shaped member and connecting the first and second heat sinks, the heat conducting member comprising;

a heat absorbing section contacting the first heat sink and adapted for connecting with a heat-generating electronic component;

first and second heat dissipating sections extending inwards from two ends of the heat absorbing section, respectively, wherein the first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section contacts a top of the second heat sink;

a first connecting section interconnecting the heat absorbing section and the first heat dissipating section; and

a second connecting section interconnecting the heat absorbing section and the second heat dissipating section;

wherein a width of the first and second heat dissipating sections and the first and second connecting sections is identical to that of the second heat sink, and the first and second heat dissipating sections completely cover tops of the first and second heat sinks, respectively.

2. The heat dissipation device as claimed in claim 1, wherein the flat, plate-shaped member is a copper plate.

3. The heat dissipation device as claimed in claim 1, wherein the flat, plate-shaped member is a vapor chamber with a work fluid filled therein.

4. The heat dissipation device as claimed in claim 1, wherein the heat absorbing section, the first and second connecting sections and the first and second heat dissipating sections are flat plates, the heat absorbing section is perpendicular relative to the first and second connecting sections, the first connecting section is perpendicular relative to the first heat dissipating sections and the second connecting section is perpendicular relative to the second heat dissipating section.

5. The heat dissipation device as claimed in claim 1, wherein the first heat sink comprises a base and a plurality of fins parallel to each other and arranged on the base, and the second heat sink comprises a plurality of fins parallel to each other.

6. The heat dissipation device as claimed in claim 5, wherein a protrusion extends downwardly from a middle portion of the base, the protrusion contacts the heat absorbing section of the heat conducting member, and a width of the protrusion is identical to that of the heat absorbing section.

7. The heat dissipation device as claimed in claim 1, further comprising a fan located at rears of the first and second heat sinks

8. A heat dissipation device, comprising:

a first heat sink;

a second heat sink located on the first heat sink;

a third heat sink located on the second heat sink; and

a heat conducting member formed by bending a flat, plate-shaped member and connecting the first, second and third heat sinks, the heat conducting member comprising a heat absorbing section contacting the first heat sink and adapted for connecting with a heat-generating electronic component, and first and second heat dissipating sections extending inwards from two ends of the heat absorbing section, respectively, wherein the first heat dissipating section is sandwiched between the first and second heat sinks, the second heat dissipating section is sandwiched between the second and third heat sinks, a width of the first and second heat dissipating sections is identical to that of the second heat sink, and the first and second heat dissipating sections completely cover tops of the first and second heat sinks respectively.

9. The heat dissipation device as claimed in claim 8, wherein the flat, plate-shaped member is a copper plate.

10. The heat dissipation device as claimed in claim 8, wherein the flat, plate-shaped member is a vapor chamber with a work fluid filled therein.

11. The heat dissipation device as claimed in claim 8, wherein the heat conducting member further comprises comprising a first connecting section interconnecting the heat absorbing section and the first heat dissipating section and a second connecting section interconnecting the heat absorbing section and the second heat dissipating section.

12. The heat dissipation device as claimed in claim 11, wherein the heat absorbing section, the first and second connecting sections and the first and second heat dissipating sections are flat plates, the heat absorbing section is perpendicular relative to the first and second connecting sections respectively, the first connecting section is perpendicular relative to the first heat dissipating section, and the second connecting section is perpendicular relative to the second heat dissipating section.