TCE compensation for package substrates for reduced die warpage assembly
First Claim
1. A method for assembling die packages, comprising:
- providing a plurality of first die having respective contacts on a surface thereof;
providing a composite carrier having substrate pads on a top surface thereof, the composite carrier comprising an organic package substrate including at least one embedded metal layer therein and a bottom surface;
attaching the contacts of the plurality of die to the respective substrate pads of the composite carrier, the organic package substrate further having the bottom surface being secured to a semiconductor waferafter said attaching, removing said semiconductor wafer from said organic package substrate;
attaching a plurality of electrically conductive connectors to said bottom surface of said organic package substrate, andsawing said organic package substrate having the conductive connectors to form a plurality of singulated die packages.
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Accused Products
Abstract
A method for assembling die packages includes attaching contacts on a first side of a plurality of first die to substrate pads on a top surface of a composite carrier. The composite carrier includes a package substrate including at least one embedded metal layer having its bottom surface secured to a semiconductor wafer. The composite carrier minimizes effects of the CTE mismatch between the die and the package substrate during assembly reduces warpage of the die. After the attaching, the semiconductor wafer is removed from the package substrate. Electrically conductive connectors are attached to the bottom surface of the package substrate, and the package substrate is sawed to form a plurality of singulated die packages.
21 Citations
7 Claims
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1. A method for assembling die packages, comprising:
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providing a plurality of first die having respective contacts on a surface thereof;
providing a composite carrier having substrate pads on a top surface thereof, the composite carrier comprising an organic package substrate including at least one embedded metal layer therein and a bottom surface;
attaching the contacts of the plurality of die to the respective substrate pads of the composite carrier, the organic package substrate further having the bottom surface being secured to a semiconductor waferafter said attaching, removing said semiconductor wafer from said organic package substrate; attaching a plurality of electrically conductive connectors to said bottom surface of said organic package substrate, and sawing said organic package substrate having the conductive connectors to form a plurality of singulated die packages. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification