Semiconductor apparatus
First Claim
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1. A semiconductor apparatus comprising:
- first and second vias electrically connecting a first chip and a second chip with each other;
a first circuit unit disposed in the first chip, configured to receive test data to generate an output signal, and connected with the first via;
a second circuit unit disposed in the first chip, and connected with the second via and the first circuit unit;
a third circuit unit disposed in the second chip, and connected with the first via,wherein the first circuit unit outputs the output signal thereof to one of the first via and the second circuit unit in response to a first control signal, and the third circuit unit receives the output signal of the first circuit unit through the first via.
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Abstract
A semiconductor apparatus includes first and second vias, a first circuit unit, a second circuit unit and a third circuit unit. The first and second vias electrically connect a first chip and a second chip with each other. The first circuit unit is disposed in the first chip, receives test data, and is connected with the first via. The second circuit unit is disposed in the first chip, and is connected with the second via and the first circuit unit. The third circuit unit is disposed in the second chip, and is connected with the first via. The first circuit unit outputs an output signal thereof to one of the first via and the second circuit unit in response to a first control signal.
7 Citations
20 Claims
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1. A semiconductor apparatus comprising:
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first and second vias electrically connecting a first chip and a second chip with each other; a first circuit unit disposed in the first chip, configured to receive test data to generate an output signal, and connected with the first via; a second circuit unit disposed in the first chip, and connected with the second via and the first circuit unit; a third circuit unit disposed in the second chip, and connected with the first via, wherein the first circuit unit outputs the output signal thereof to one of the first via and the second circuit unit in response to a first control signal, and the third circuit unit receives the output signal of the first circuit unit through the first via. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor apparatus comprising:
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a scan circuit block including a receiving section configured to generate an output signal from one of an output signal of another circuit unit which is disposed in a first chip and an output signal of a circuit unit which is disposed in a second chip, in response to a second control signal; and an output section configured to output the output signal of the receiving section to one of still another circuit unit which is disposed in the first chip and a circuit unit which is disposed in a third chip, in response to a first control signal, wherein the scan circuit block is disposed in the first chip. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor apparatus comprising:
- a first via electrically connecting a first chip and a second chip;
a first circuit unit disposed in the first chip, configured to receive test data to generate an output signal, and connected with the first via;
a second circuit unit disposed in the first chip; and
wherein the first circuit unit outputs the output signal to one of the first via and the second circuit unit in response to a first control signal, and a third circuit unit receives the output signal of the first circuit unit through the first via. - View Dependent Claims (17, 18, 19, 20)
- a first via electrically connecting a first chip and a second chip;
Specification