Electrode array assembly and method of making same

• US 8,650,747 B2
• Filed: 09/14/2012
• Issued: 02/18/2014
• Est. Priority Date: 01/11/2005
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Kuzma, Janusz A., Pianca, Anne Margaret
• Primary Examiner(s): ANGWIN, DAVID PATRICK
• Application Number:
  US13/620,099
• Publication Number:
  US 20130023972A1
• Time in Patent Office: 522 Days
• Field of Search: 298/25, 607115-122
• US Class Current: 29/825
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/0553 Paddle shaped electrodes, e.g. for laminotomy
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 by assembling plural parts
• CPC Class Codes: Y10T 29/4922 with molding of insulation

Abstract

A stimulation lead assembly for making a lead includes a lead body defining a central lumen extending along the lead body and multiple conductor lumens disposed circumferentially around the central lumen and extending along the lead body; electrically conductive contacts disposed along an end of the lead body with a portion of each of the conductor lumens disposed radially underneath the conductive contacts conductor wires disposed in the conductor lumens with at least one of the conductor wires electrically connected to each conductive contact; and a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts within portions of the conductor lumens not occupied by conductor wire.

Claims

1. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed radially underneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is electrically connected to each conductive contact, wherein each conductor lumen comprises an occupied portion within which at least one of the conductor wires is disposed and an unoccupied portion in which none of the conductor wires is disposed, the unoccupied portion extending from an end of the conductor lumen; and

a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts and filling the unoccupied portion of at least one of the conductor lumens;

wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material to thermally reflow or melt.

2. The lead assembly of claim 1, comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

3. The lead assembly of claim 2, wherein the spacers and the non-conductive material arc thermally fused together from heat applied to the lead assembly.

4. The lead assembly of claim 3, wherein a material of the spacers and the non-conductive material are a same material.

5. The lead assembly of claim 3, wherein a material of the spacers and the non-conductive material are different materials.

6. The lead assembly of claim 1, wherein the plurality of electrically conductive contacts are located on a proximal end of the stimulation lead.

7. The lead assembly of claim 1, wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

8. The lead assembly of claim 1, wherein the non-conductive material is Polyurethane.

9. The lead assembly of claim 1, wherein the plurality of conductor lumens is exactly eight conductor lumens.

10. The lead assembly of claim 1, wherein the non-conductive material fills the unoccupied portion of each of the conductor lumens.

11. A stimulation lead assembly for making a lead, the assembly comprising:

a lead body defining a central lumen extending along the lead body and a plurality of conductor lumens disposed circumferentially around the central lumen and extending along the lead body;

a plurality of electrically conductive contacts disposed along an end of the lead body, wherein a portion of each of the conductor lumens is disposed radially underneath the conductive contacts;

a plurality of conductor wires disposed in the conductor lumens, wherein at least one of the conductor wires is electrically connected to each conductive contact; and

a solid, non-conductive material disposed, at least in part, radially underneath the conductive contacts within portions of the conductor lumens not occupied by conductor wire.

12. The lead assembly of claim 11, wherein the non-conductive material is thermally fused with the lead body from heat applied to the lead assembly, which heat is at a temperature to cause the non-conductive material, to thermally reflow or melt.

13. The lead assembly of claim 11, further comprising a plurality of spacers disposed between adjacent pairs of the conductive contacts.

14. The lead assembly of claim 13, wherein the spacers and the non-conductive material are thermally fused together from heat applied to the lead assembly.

15. The lead assembly of claim 11, wherein a material of the spacers and the non-conductive material are a same material.

16. The lead assembly of claim 11, wherein a material of the spacers and the non-conductive material are different materials.

17. The lead assembly of claim 11, wherein the plurality of electrically conductive contacts are located on a proximal end of the stimulation lead.

18. The lead assembly of claim 11, wherein the plurality of electrically conductive contacts are located on a distal end of the stimulation lead.

19. The lead assembly of claim 11, wherein the non-conductive material is thermally fused with the lead body.