Printed circuit board assembly sheet and method for manufacturing the same
DCFirst Claim
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1. A printed circuit board assembly sheet comprising:
- a plurality of printed circuit boards;
a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings; and
a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame,wherein said plurality of printed circuit boards are each configured to be separated from said support frame and said dummy trace portion is configured not to be separated from said support frame, andwherein each of said plurality of printed circuit boards and said dummy trace portion includes;
a support substrate;
a first insulating layer formed on said support substrate;
a plurality of conductor traces formed on said first insulating layer; and
a second insulating layer formed on said first insulating layer to cover said plurality of conductor traces,a groove is not formed in said first insulating layer in a region between adjacent conductor traces in said dummy trace portion, anda groove is formed in said second insulating layer in a region between adjacent conductor traces in said dummy trace portion.
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Abstract
A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
9 Citations
14 Claims
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1. A printed circuit board assembly sheet comprising:
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a plurality of printed circuit boards; a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings; and a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame, wherein said plurality of printed circuit boards are each configured to be separated from said support frame and said dummy trace portion is configured not to be separated from said support frame, and wherein each of said plurality of printed circuit boards and said dummy trace portion includes; a support substrate; a first insulating layer formed on said support substrate; a plurality of conductor traces formed on said first insulating layer; and a second insulating layer formed on said first insulating layer to cover said plurality of conductor traces, a groove is not formed in said first insulating layer in a region between adjacent conductor traces in said dummy trace portion, and a groove is formed in said second insulating layer in a region between adjacent conductor traces in said dummy trace portion. - View Dependent Claims (4, 5, 6)
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2. A printed circuit board assembly sheet comprising:
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a plurality of printed circuit boards; a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings; and a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame, wherein said plurality of printed circuit boards are each configured to be separated from said support frame, and said dummy trace portion is configured not to be separated from said support frame, and wherein each of said plurality of printed circuit boards and said dummy trace portion includes; a support substrate; a first insulating layer formed on said support substrate; a plurality of conductor traces formed on said first insulating layer; and a second insulating layer formed on said first insulating layer to cover said plurality of conductor traces, at least one of said first and second insulating layers in said dummy trace portion has a groove, and at least one opening is formed in said support substrate to overlap said plurality of conductor traces in said dummy trace portion. - View Dependent Claims (3, 11, 12, 13, 14)
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7. A printed circuit board assembly sheet comprising;
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a plurality of printed circuit boards; a support frame configured to integrally support said plurality of printed circuit boards such that said plurality of printed circuit boards are arranged at spacings; and a dummy trace portion provided in a region between at least a printed circuit board on one end side and said support frame, wherein said plurality of printed circuit boards are each configured to be separated from said support frame, and said dummy trace portion is configured not to be separated from said support frame, and wherein each of said plurality of printed circuit boards and said dummy trace portion includes; a support substrate; a first insulating layer formed on said support substrate; a plurality of conductor traces formed on said first insulating layer; and a second insulating layer formed on said first insulating layer to cover said plurality of conductor traces, a groove is formed in said first insulating layer in a region between adjacent conductor traces in said dummy trace portion, and a groove is not formed in said second insulating layer in a region between adjacent conductor traces in said dummy trace portion. - View Dependent Claims (8, 9, 10)
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Specification